Vortrag

Next-Generation Fine-Line PCB Solutions for the Age of AI

  • von -
  • Halle B3B3.360
  • Sprache: Englisch
  • Vortragstyp: Vortrag

Vortragsbeschreibung

As AI becomes more widespread, printed circuit boards (PCBs) used in data centers and mobile devices are required to deliver higher speeds, smaller form factors, and enhanced functionality. Our copper foils are widely applied in various high-end PCBs, supporting their ongoing advancement. In this lecture, we will highlight the latest trends in fine-line PCB technology and introduce our copper foil solutions that address these emerging requirements.

#productronica
© Messe München GmbH