Future Packaging Live Production Line
The “Future Packaging Hybrid Live Lab” line highlights all aspects of the assembly and interconnection technology (AIT) value chain. The focus is on answering the question: How can process steps be designed through extensive automation and digitalization to achieve maximum robustness against errors?
Fraunhofer IZM organizes the line.
What to Expect at the Joint Booth
Twenty-one exhibitors will present a continuous live production line spanning 360 square meters. The entire PCB manufacturing process will be demonstrated, from bare boards to finished, separated panels. A dashboard is also being developed for visualization purposes. To enable comparison of a variety of processes, the line will feature board labeling by label versus laser, stencil printing versus paste dispensing, and laser versus panel milling separation.
This will demonstrate the current capabilities of modern technologies and processes in printed circuit board manufacturing.
In the real-world laboratory, the line's actual consumption is recorded to demonstrate its impact on the CO₂ footprint of assembly production.
Gain live insights even before the trade fair!
Starting at the end of September, you can follow the preparations on the Future Packaging website and social media channels. Daily live updates and short videos will document the process.
- Machines, processes, and technologies of the line
- Background topics on manufacturing
- The development of the accompanying marketing concept
Event details
Where?
Hall B2, Booth 261
When?
November 18–21, 2025
Guided tours:
Twice daily at 10:00 and 14:00