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productronica Innovation Award
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Exhibitors at productronica 2025 had the opportunity to present their companies in a forum that is unique worldwide. For the sixth time, productronica and the magazine "productronic" presented the "productronica Innovation Award". The award honors the most innovative new products and manufacturing processes in six categories.
Since 2023, second and third place winners will also be honored.
The winners of the productronica Innovation Award 2025!
Komax AG
Winner 2025 in the Cables, Coils & Hybrids Cluster.
With its Adaptive Incision Control (AIC) system, KOMAX has achieved a decisive leap forward in innovation in automated cable processing. The jury was particularly impressed by the system's ability to automatically compensate for wire diameters, which increases efficiency, reduces waste, and simplifies operation. By combining artificial intelligence and mechanical testing, AIC enables autonomous analysis and parameter adjustment—without any manual programming. The integration of inline quality control also ensures greater process reliability and traceability.
Xplain Data
Winner 2025 in the Future Markets Cluster.
With CausalDiscover YieldPro, Xplain Data presents an innovative AI tool that goes far beyond traditional forecasting methods. Instead of just making predictions, the solution explains the causes of process events, enabling targeted optimizations in electronics manufacturing. Thanks to patented object analytics technology, for the first time ever, all production data from design to AOI is analyzed holistically and without loss. This allows hidden quality problems to be quickly identified, downtime to be reduced, and efficiency to be increased in the long term.
Palitronica
Winner 2025 in the Inspection & Quality Cluster.
With the Anvil Checkpoint, Palitronica has succeeded in developing an idea from the laboratory into a device ready for series production. Using the RF echo reflectometry method, they have succeeded in detecting defects and deviations in electronic assemblies in comparison with a known original component. This means that not only deviations from the assembly of materials can be detected, but also malicious fabrications.
SCHMID Group | Gebr. SCHMID GmbH
Winner 2025 in the PCB & EMS Cluster.
With the InfinityLine L+, Schmid Group is redefining chemical-mechanical planarization (CMP) for next-generation substrates. The system transfers proven semiconductor processes to printed circuit board manufacturing and enables precise processing of even thin and flexible materials. Thanks to fully automated operation and live monitoring, maximum process reliability and consistent quality are guaranteed. The solution is scalable for series production and bridges the gap between PCB and semiconductor technologies – an important step towards panel level packaging.
AP&S International GmbH
Winner 2025 in the Semiconductors Cluster.
With “CleanSurF automated,” AP&S International is setting new standards in semiconductor manufacturing. The solution addresses a key issue in modern chip production—the reliable prevention of cross-contamination—thus ensuring maximum process reliability. Its compact design, high efficiency, and flexible integration into automated systems make it ideal for cleanrooms with limited space. The robot-based architecture and camera-monitored cleaning technology guarantee precise and safe processes. A forward-looking system that combines automation, cleanliness, and performance in one solution.
Ersa GmbH
Winner 2025 in the SMT Cluster.
With the “VERSAFIT One,” ERSA presents a semi-automatic press-in machine that combines precision, process reliability, and ease of use. It enables flux-free press-in without thermal stress, ensuring high-load electrical connections with minimal contact resistance. Thanks to quick tool changes and scalability from prototype to series production, it is ideal for small and medium-sized companies. The machine is particularly suitable for applications in power electronics, such as in e-mobility, energy, and charging technology. A practical solution that closes the gap between manual and fully automated production.
Second and third places
Cables, Coils & HybridsCluster
2nd place: Cellios GmbH with "intRAC (Intelligent Robotic Assembly Cell)"
3rd place: Zoller & Fröhlich GmbH with "Z+F AM UP6"
Future Markets Cluster
2nd place: SEHO Systems GmbH with "Process-integrated verification of flux application"
3rd place: JUKI Automation Systems GmbH with "JM E-01"
Inspection & Quality Cluster
2nd place: Koh Young Europe GmbH with "Koh Young Process Optimizer"
3rd place: Mirtec GmbH with "GENESYS-CC"
PCB & EMS Cluster
2nd place: Schmoll Maschinen GmbH with "PicoCombi"
3rd place: Notion Systems GmbH with "n.jet soldermask - multi-color inkjet printing"
Semiconductors Cluster
2nd place: F&S BONDTEC Semiconductor GmbH with "3D-Bonder"
3rd place: —
SMT Cluster
2nd place: Grif Tools Kft with "MPG - Multi Parallel Gripper"
3rd place: IO Tech - Reophotonics Ltd with "io600"
The jury
All submitted applications will be reviewed and evaluated by a panel of highly qualified and competent industry experts.
- PCB & EMS Cluster:
Dr. Andrej Novikov (Uni Rostock) - SMT Cluster:
Dr. Maik Hampicke (Fraunhofer IZM) - Inspection & Quality Cluster:
Helge Schimanski (Fraunhofer ISIT) - Semiconductors Cluster:
Dr.-Ing. Udo Gommel (Fraunhofer IPA) - Cables, Coils & Hybrids Cluster:
Sebastian Glatz (ZVEI e.V.) - Future Markets Cluster:
Dr. Sandra Engle (VDMA)
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