Lecture
Materials Technology for Flux-Free Soldering Applications
- at -
- Hall A1A1.105
- Language: English
- Type: Lecture
Lecture description
Description: With the increase in adoption of formic acid reflow techniques in applications such as power electronics, we will examine best practices for flux-free soldering process development, and materials selection considerations given the current state-of-the art and emerging solder alternatives, including novel solder paste technology that reduces process steps, cycle times, and improves efficiency in mass production.
