Advanced Die Packaging Solutions for Scalable Quantum Devices

The quantum technologies market is projected to exceed $97B by 2035, with quantum computing driving growth alongside advances in quantum sensing and quantum communication. Scaling these applications requires packaging solutions that meet demanding requirements such as sub-micron accuracy, cryogenic performance, and process flexibility. This talk explores advanced die bonding approaches for superconducting processors, photonic integration, and devices supporting quantum key distribution—bridging early-stage innovation with industrial-scale manufacturing.