Lecture Hall B2 Innovation Forum
15:40 -15 :55 h | Hall B2 .441
Subjects: Organic and printed electronicsSpeaker: Thomas Veit (Merconics, on behalf of NovaCentrix)
Part of the session: Printing Technologies and Materials
The use of low-temperature flexible substrates and of temperature-sensitive components such as batteries and interconnects is hindered by current EMS reflow oven technologies. The use of flash lamps to deliver energy for reflowing solder is shown to be a solution enabling the use these materials and components, augmenting the capabilities of reflow ovens. The flash lamps use visible light as the energy source to uniformly radiate a large exposure area and reflow a range of off-the-shelf solders including SAC305 materials. This in turn enables product designers to combine components, substrates and solder alloys that are not feasible with reflow ovens while allowing very high volume – high throughput – manufacturing processes. Additionally, measurements and calculations show that this soldering technology can offer a substantial energy savings from traditional reflow ovens. Finally, such tools are substantially smaller than reflow ovens.
This work reports the latest finding on soldering SMT components, including temperature sensitive components such as batteries and interconnects, using standard high temperature off-the-shelf lead free solder alloys (e.g. SAC305) utilizing flashlamp soldering. Initial considerations and general design rules necessary for defining a flashlamp soldering process are outlined.