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VIA activities toward ZVEI Roadmap

NOV
16
2021
16 . NOV 2021

Lecture Hall B3 PCB & EMS Speakers Corner

14:00 -14 :30 h | Hall B3 .360

Subjects: PCB and circuit-carrier manufacturing

Speaker: Marc Bochard (VIA electronic)

Type: Lecture

Speech: English

The actual ZVEI roadmap underlines various R&D activities at VIA Electronic.
As part of the Infersat joint project, VIA has successfully integrated ferrites into LTCC, significantly reducing the size of RF systems by downsizing elements such as circulators that is a key for satellite and onboard applications.
In the RobopS joint project, a technology kit has been developed based on innovative LTCC and hermetic joining processes at wafer level using anodic bonding.
In the joint project ElisA, is developed a new possibility for the assembly of temperature-sensitive components. Nanoscale, reactive material systems for joining components on LTCC can be successfully deposited by galvanic deposition.

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Speaker,
VIA electronic

Marc Bochard

Marc Bochard

VIA electronic

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Informations

Marc Bochard title=
Marc Bochard

Speaker,
VIA electronic

Marc Bochard
Marc Bochard

Location

Eingang
Nord-West
ICM
Eingang
Nord
Eingang
West
Atrium
Eingang
Nord-Ost
Eingang
Ost
Conference
Center Nord
Freigelände
C1
C2
C3
C4
C5
C6
B0
B1
B2
B3
B4
B5
B6
A1
A2
A3
A4
A5
A6

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