Lecture Hall B3 PCB & EMS Speakers Corner
14:00 -14 :30 h | Hall B3 .360
Subjects: PCB and circuit-carrier manufacturingSpeaker: Marc Bochard (VIA electronic)
The actual ZVEI roadmap underlines various R&D activities at VIA Electronic.
As part of the Infersat joint project, VIA has successfully integrated ferrites into LTCC, significantly reducing the size of RF systems by downsizing elements such as circulators that is a key for satellite and onboard applications.
In the RobopS joint project, a technology kit has been developed based on innovative LTCC and hermetic joining processes at wafer level using anodic bonding.
In the joint project ElisA, is developed a new possibility for the assembly of temperature-sensitive components. Nanoscale, reactive material systems for joining components on LTCC can be successfully deposited by galvanic deposition.