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Veranstaltungskalender

Informationen zu Foren, Live-Demonstrationen, Accelerating Talents und Diskussionsrunden. In der Termindatenbank finden Sie auch das gesamte Forenprogramm.

481 Einträge gefunden

Session / Halle Eingang West / SEMICON EUROPA > Press Conference > Press Conference

Press Conference

09:00-10:00 Uhr | Eingang West Press Center West

Vortrag / Halle B2 / Talent Stage

Invest in Bavaria

10:00-10:30 Uhr | Halle B2 Talent Stage, B2, booth 470

Sprecher: Johanna Hebestreit

Session / Halle B2 / SEMICON EUROPA > SMART Workforce > SEMI Opening by Cassandra Melvin, Director of Operations, SEMI Europe

SEMI Opening by Cassandra Melvin, Director of Operations, SEMI Europe

10:00-10:05 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Cassandra Melvin (SEMI Europe)

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Standards Meeting

PV Materials Degradation (TF)

10:00-11:30 Uhr | ICM - Internationales Congress Center München ICM Room 12a, 1st Floor

Opening Ceremony / Halle B1 / SEMICON EUROPA > Opening Ceremony & Keynote > Executive Keynotes Opening Ceremony

Opening & Welcome Remarks

10:00-10:20 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Presentation / Halle B2 / SEMICON EUROPA > SMART Workforce > Session 1: Skills to Accelerate Your Career

How to Approach the Semiconductors Skills Shortage

10:25-10:45 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM > Connected Healthcare

Health-IT: One Step Further in Making our Hospital Digital

10:30-11:00 Uhr | ICM - Internationales Congress Center München

Sprecher: Dr. Karsten Königstein (Sinfosy)

Vortrag / Halle B3

Wege und Einflussfaktoren zu elektrostatischen Aufladungen (ESD)

10:30-11:00 Uhr | Halle B3 Stand 172, Stat-X ESD-Komptenzzentrum

Presentation / Halle B2 / SEMICON EUROPA > SMART Workforce > Session 1: Skills to Accelerate Your Career

METIS: MicroElectronics Training, Industry and Skills: Europe’s Newest and Largest Electronics Education Initiative

10:45-11:05 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Roundtable / Halle A1 / productronica Forum

Round Table: How are manufacturers coping with shifting supply chains?

11:00-11:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 1: Trends and Vision

Opening and Welcome Remarks

11:00-11:10 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Standards Meeting

Int'l Polished Wafer (TF)

11:00-12:00 Uhr | ICM - Internationales Congress Center München ICM Room 12b, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Workforce > Session 2: Technology’s Impact on Sustainable Development

The UN IPCC GHG Guidelines (2019) and the Impact on the Semiconductor Industry;What are the Changes & Implications?

11:05-11:25 Uhr | ICM - Internationales Congress Center München ICM Room 1, Ground Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 1: Trends and Vision

11:10-11:15 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 1: Trends and Vision

2019 Semiconductor Equipment and Materials Market: Where are we headed?

11:15-11:40 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Workforce > Session 2: Technology’s Impact on Sustainable Development

IoT with a Soft Touch: Connecting for a Sustainable Future

11:25-11:45 Uhr | ICM - Internationales Congress Center München ICM Room 1, Ground Floor

Roundtable / Halle A1 / productronica Forum

Round Table: How important is inline x-ray in factory automation?

11:30-12:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Standards Meeting

PV Si Materials (TF)

11:30-12:30 Uhr | ICM - Internationales Congress Center München ICM Room 12a, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 1: Trends and Vision

Self-organization, hype or hope? How to leverage the potential benefits of speeding up in a VUCA world

11:40-12:05 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Russia on the Edge of Digital Transformation

From National Russian Projects to Global Markets: International Cooperation in Manufacturing of Electronics and Radio-electronics

11:45-11:55 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: Vasiliy Shpak (Ministry of Industry and Trade of Russian Federation)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Workforce > Session 2: Technology’s Impact on Sustainable Development

Semiconductor Manufacturing – Enabling the Data Revolution

11:45-12:05 Uhr | ICM - Internationales Congress Center München ICM Room 1, Ground Floor

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Russia on the Edge of Digital Transformation

Disruptive NVM Technologies in Russia

11:55-12:05 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: Nikolay Salynsky (CrocusNano Electronics (CNE))

Workshop / Halle B2 / Talent Stage

Startup aber wie?

12:00-13:30 Uhr | Halle B2 Talent Stage, B2, booth 470

Sprecher: Start A Factory

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 1: Advanced Packaging Market Analytics

12:00-12:10 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Standards Meeting

Silicon Wafer GCS

12:00-13:00 Uhr | ICM - Internationales Congress Center München ICM Room 12b, 1st Floor

Vortrag / Smart Maintenance Pavillon / mfa

Discover Victoria's Secret, with Eye Tracking!

12:00-13:00 Uhr | Smart Maintenance Pavillon, Halle B2, Standnr. 133

Session / Halle B2 / SEMICON EUROPA > SMART Workforce > Career Café

12:05-13:00 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 1: Trends and Vision

Young Talents, generational Conflict and increasing Digitization: Transformation Models for high performing Organization

12:05-12:30 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Keynote / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 1: Advanced Packaging Market Analytics

Packaging Trends for AI

12:10-12:40 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Sprecher: Jan Vardaman (TechSearch International, Inc.)

Session / Halle B1 / SEMICON EUROPA > Opening Ceremony & Keynote > Executive Keynotes Opening Ceremony

12:25-12:30 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 1: Trends and Vision

Clash of Generations? – Changing Motivations, Requirements and Communication Styles as Seen by Young Professionals

12:30-12:45 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Standards Meeting

PV Materials (TC)

12:30-14:00 Uhr | ICM - Internationales Congress Center München ICM Room 12a, 1st Floor

Vortrag / PCB & EMS Speakers Corner

Quick Tests for Optimizing Conformal Coating Processes

12:30-13:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Dr. Helmut Schweigart (ZESTRON Europe ...a Business Division of Dr. O.K. Wack Chemie GmbH)

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 1 - Materials and Processes for Wafer-Level Packaging

12:30-12:40 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Session / Halle B1 / SEMICON EUROPA > Young Disruptors > Young Disruptors

12:30-12:55 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Keynote / Halle B2 / Innovation Forum

Key Note: Industry is about to change the world. Again - 5G Campus Networks for the next generation of connectivity and sensing.

12:30-13:00 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Markus Fessler (NOKIA)

Keynote / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 1: Advanced Packaging Market Analytics

5G enabler : Advanced Packaging

12:40-13:10 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Sprecher: Emilie Jolivet (Yole Développement)

Break / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 1: Trends and Vision

12:55-13:40 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Session / Halle B1 / SEMICON EUROPA > Young Disruptors > Young Disruptors

12:55-13:20 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Presseveranstaltung

Pressetermin ZVEI 12. November 2019

13:00-14:00 Uhr | Konferenzraum Pressezentrum West

Vortrag / Halle B2

Boosting Productivity with Industrial IoT & AI

13:00-13:30 Uhr | Halle B2 Innovation Forum, B2, booth 441

Panel / Halle B2 / SEMICON EUROPA > SMART Workforce > Panel discussion: Diversity & Inclusion for High Performance Teams

Panel Opening by Emily Clark, SSC Sales, Applied Materials

13:00-13:10 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Presentation / Halle B1 / SEMICON EUROPA > Challenges of Moores Law > Challenges for Moore’s Law

Challenges for the end of Moore Law

13:00-13:25 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Vortrag / PCB & EMS Speakers Corner > The Cradle of Electronics Industry 4.0 – RFID in the SMT Process and Beyond

Collaborating for Electronics Industrie 4.0 - With RFID from Cradle to Cradle

13:00-13:10 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Alexander M. Schmoldt (Murata Manufacturing Co., Ltd.)

Vortrag / Innovation Forum

Non Destructive coating layer measurements with handheld portable analyzer

13:00-13:30 Uhr | Innovation Forum, B2, booth 441

Sprecher: Thomas Sauer (OLYMPUS EUROPA SE & Co. KG)

Workshop / Smart Maintenance Pavillon / mfa

Angewandte Kryptographie für Embedded Entwickler und Hardware-Ingenieure

13:00-14:00 Uhr | Halle B2 Standnr. 133

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 1 - Materials and Processes for Wafer-Level Packaging

Polymeric materials for Advanced packaging

13:10-13:40 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Keynote / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 2: Test and Reliability I

Semiconductors in a world where safety rules supreme

13:10-13:40 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Sprecher: Michael Schuldenfrei (Optimal Plus, Business and Technology)

Panel / Halle B2 / SEMICON EUROPA > SMART Workforce > Panel discussion: Diversity & Inclusion for High Performance Teams

Panel discussion: Diversity & Inclusion for High Performance Teams

13:10-14:00 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Vortrag / PCB & EMS Speakers Corner > The Cradle of Electronics Industry 4.0 – RFID in the SMT Process and Beyond

Creating the PCB 4.0 with RFID - Is there a smarter way towards Industrie 4.0?

13:10-13:20 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Alexander M. Schmoldt (Murata Manufacturing Co., Ltd.)

Session / Halle B1 / SEMICON EUROPA > Young Disruptors > Young Disruptors

13:20-13:45 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / PCB & EMS Speakers Corner > The Cradle of Electronics Industry 4.0 – RFID in the SMT Process and Beyond

At the True Cradle - Embedding RFID into the PCB

13:25-13:45 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Gernot Seeger (Beta LAYOUT GmbH)

Presentation / Halle B1 / SEMICON EUROPA > Challenges of Moores Law > Challenges for Moore’s Law

EU consortia joining forces to tackle challenges of advanced technology nodes

13:25-13:50 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Vortrag / Halle A1 / productronica Forum

Automotive Flash Memory Growth and the Production Bottleneck Dilemma: Accelerating the Transition from e.MMC to 3D UFS in Manufacturing for the Connected Car

13:30-14:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Anthony Ambrose (Data I/O GmbH)

Vortrag / Halle B2 / Innovation Forum

Elisa Smart Factory - Boosting Productivity with Industrial IoT and AI

13:30-14:00 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Kari Terho (Elisa Smart Factory)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 1 - Materials and Processes for Wafer-Level Packaging

Innovative Interconnect and Encapsulation Developments for Wafer Level Packaging

13:40-14:05 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 2: Test and Reliability I

Development of a Modular Test Setup for Reliability Testing under Harsh Environment Conditions

13:40-14:05 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 2: Manufacturing Excellence - The Next Stage!

13:40-13:45 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 2: Manufacturing Excellence - The Next Stage!

Manufacturing Data Analytics for Future Fabs

13:45-14:10 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Session / Halle B1 / SEMICON EUROPA > Young Disruptors > Young Disruptors

13:45-14:10 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / PCB & EMS Speakers Corner > The Cradle of Electronics Industry 4.0 – RFID in the SMT Process and Beyond

RFID Systems in the SMT process and beyond - The Highway to Industrie 4.0

13:50-14:10 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: O. Wilmsmeier (Harting)

Break / Halle B2 / SEMICON EUROPA > SMART MedTech > The Digitization of Preventive Healthcare

13:55-14:15 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Presentation / Halle B2 / SEMICON EUROPA > SMART Workforce > Panel discussion: Diversity & Inclusion for High Performance Teams

WW Transactional CX Survey Program Manager, Hewlett Packard Enterprise

14:00-14:25 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Vortrag / Innovation Forum

Plug & play digitalization for up to 30% higher productivity

14:00-14:30 Uhr | Innovation Forum, B2, booth 441

Sprecher: Ariel Rosenfeld (Elisa Smart Factory)

Vortrag / Halle A1 / productronica Forum

Business Outlook: Global Electronics Industry (with emphasis on Europe)

14:00-14:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Walter Custer (Custer Consulting Group)

Roundtable / Halle B2 / Talent Stage

Education Path: Quo Vadis: Berufliche Erst- und Fortbildung, wo soll der Weg hingehen?

14:00-15:30 Uhr | Halle B2 Talent Stage, B2, booth 470

Presseveranstaltung

Pressetermin Viscom AG deutsch

14:00-14:30 Uhr | Halle A2, Standnr. 177

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Standards Meeting

Int'l Advanced Surface Inspection (TF)

14:00-15:00 Uhr | ICM - Internationales Congress Center München ICM Room 12b, 1st Floor

Presseveranstaltung

Presseveranstaltung LH Dresden

14:00-15:00 Uhr | Konferenzraum B12

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 1 - Materials and Processes for Wafer-Level Packaging

Temporary Bonding Materials: The Future Beyond Temporary Thin Wafer Handling

14:05-14:30 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 2: Test and Reliability I

Product on Board Test Method for Advanced Reliability Performance of a Large 0.3 mm Pitch Wafer Level Chip Scale Package

14:05-14:30 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Session / Halle B1 / SEMICON EUROPA > Young Disruptors > Young Disruptors

14:10-14:35 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 2: Manufacturing Excellence - The Next Stage!

Full Factory Scheduling

14:10-14:35 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Vortrag / PCB & EMS Speakers Corner > The Cradle of Electronics Industry 4.0 – RFID in the SMT Process and Beyond

The OEM Perspective: Use of RFID on PCB in Relevant Processes

14:15-14:35 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: T. Skoczowski (Bruker)

Session / Halle B2 / SEMICON EUROPA > SMART Workforce > Career Café

14:25-15:00 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 1 - Materials and Processes for Wafer-Level Packaging

Ultra-Low Stress Silicone Die-Attach Film For Stress Sensitive, SiP and Stacked Dies Assembly

14:30-14:55 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Workshop / Halle B3

Verpackungssysteme im ESD-Schutz und ihre Anwendungsbereiche

14:30-15:00 Uhr | Halle B3 Stand 172, Stat-X ESD-Komptenzzentrum

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 2: Test and Reliability I

Stretching the Performance Envelope of ATE PCBs

14:30-14:55 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Vortrag / Halle B2 / Innovation Forum > Obsolescence Track

IEC 62402:2019: Obsolescence Management

14:30-14:50 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Dr. Wolfgang Heinbach (COGD (Component Obsolescence Group Deutschland) e.V)

Presseveranstaltung

Viscom press event

14:30-15:00 Uhr | Halle A2, Standnr. 177

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 2: Manufacturing Excellence - The Next Stage!

Automated Hardware Diagnosis and Qualification

14:35-15:00 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Session / Halle B1 / SEMICON EUROPA > Young Disruptors > Young Disruptors

14:35-15:00 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / PCB & EMS Speakers Corner > The Cradle of Electronics Industry 4.0 – RFID in the SMT Process and Beyond

The EMS Perspective: The Potential for RFID on PCBs

14:40-14:55 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: J. Kokert (Eltroplan)

Vortrag / Halle B2 / Innovation Forum > Obsolescence Track

smartPCN/ VDMA 24903

14:50-15:15 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Anke Bartel (Velocity Electronics GmbH)

Vortrag / PCB & EMS Speakers Corner > The Cradle of Electronics Industry 4.0 – RFID in the SMT Process and Beyond

Closing remarks

14:55-15:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Alexander Schmoldt (Chairman of Consortium "RFID Valuecreators")

Break / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 1 - Materials and Processes for Wafer-Level Packaging

14:55-15:30 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 2: Test and Reliability I

Don't Let Your ADAS Chips Crash! Test Them!

14:55-15:20 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Session / Halle B2 / SEMICON EUROPA > SMART Workforce > Interview with Bina48, Humanoid Robot by Ajit Manocha, President and CEO, SEMI

Interview with Bina48, Humanoid Robot by Ajit Manocha, President and CEO, SEMI

15:00-15:30 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Vortrag / Smart Maintenance Pavillon / mfa

Bringing legacy systems into Industry 4.0

15:00-16:00 Uhr | Smart Maintenance Pavillon, Halle B2 Standnr. 133

Vortrag / Halle B3 / PCB & EMS Speakers Corner

Achieving thermal management improvements with specialised coatings applied on printed circuit board level – possibilities and experiences

15:00-15:30 Uhr | Halle B3 PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Dr. Pavel Gentschev (Lackwerke Peters)

Session / Halle B1 / SEMICON EUROPA > Young Disruptors > Young Disruptors

Closing remarks

15:00-15:05 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 2: Manufacturing Excellence - The Next Stage!

Edwards EUV Availability Programme

15:00-15:25 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Standards Meeting

Int' Advanced Wafer Geometry (TF)

15:00-17:00 Uhr | ICM - Internationales Congress Center München ICM Room 12b, 1st Floor

Presentation / Halle B1 / SEMICON EUROPA > Challenges of Moores Law > Challenges for Moore’s Law

Closing remarks

15:05-15:10 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Session / Halle B1 / SEMICON EUROPA > MADEin4 Session > Digitized Electronics & Industry 4.0: The MADEin4 Initiative

15:15-15:20 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Presentation / Halle B1 / SEMICON EUROPA > Technology for Communication > Technology for Communication

Building European ecosystem on SOI to answer Societal challenges of Smart Mobility and Communication

15:15-15:35 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Session / Halle B1 / SEMICON EUROPA > MADEin4 Session > Digitized Electronics & Industry 4.0: The MADEin4 Initiative

Metrology Advances for Digitized ECS Industry 4.0 (MADEin4 Overall Concept)

15:20-15:40 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Break / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 2: Test and Reliability I

15:20-16:00 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 3: Poster session - Shop Floor Innovations with Immediate Payback

15:25-15:30 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 3: Poster session - Shop Floor Innovations with Immediate Payback

Development of an Efficient Software-Backup-Management-System for Semiconductor Equipment Controllers

15:30-15:35 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Panel / Halle B2 / SEMICON EUROPA > SMART Workforce > Panel Discussion: Leading in the Digital Age: How Technology is Reshaping Leadership

15:30-15:40 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 2 - Substrates

SiGeSn – A new (old) building block for nano- and optoelectronic devices

15:30-15:55 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Vortrag / Halle B2 / Innovation Forum > Obsolescence Track

COGD & IIOM – National and international Obsolescence Management associations

15:30-15:50 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Dr. Wolfgang Heinbach (COGD (Component Obsolescence Group Deutschland) e.V)

Vortrag / PCB & EMS Speakers Corner

Interaction between substrate and adhesive – For Wearables and beyond

15:30-16:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Ian Chitty (GTS Flexible Materials)

Vortrag / Halle B2 / Talent Stage

Welcome to Bavaria - Europe's Economic Powerhouse!

15:30-16:00 Uhr | Halle B2 Talent Stage, B2, booth 470

Sprecher: Andreas Fischer (Invest in Bavaria)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 3: Poster session - Shop Floor Innovations with Immediate Payback

Fab cost saving programs with Siconnex Batchspray® Technology

15:35-15:40 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle B1 / SEMICON EUROPA > Technology for Communication > Technology for Communication

5G radios – commercial challenges and opportunities

15:35-15:55 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Session / Halle B1 / SEMICON EUROPA > MADEin4 Session > Digitized Electronics & Industry 4.0: The MADEin4 Initiative

Metrology Platforms Developments for Enhanced Productivity

15:40-16:00 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Panel / Halle B2 / SEMICON EUROPA > SMART Workforce > Panel Discussion: Leading in the Digital Age: How Technology is Reshaping Leadership

Panel discussion Leading in the Digital Age: How Technology is Reshaping Leadership

15:40-16:30 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 3: Poster session - Shop Floor Innovations with Immediate Payback

Hardware “Automatic Defect Classification”

15:40-15:45 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 3: Poster session - Shop Floor Innovations with Immediate Payback

Digital Twin / Ion Source Prediction

15:45-15:50 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Vortrag / Halle B2 / Innovation Forum > Obsolescence Track

Repair vs. Disposable society - is there a second life?

15:50-16:10 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Michael Knöferle (BMK Group)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 3: Poster session - Shop Floor Innovations with Immediate Payback

Use of AI based predictive maintenance solutions to predict failures and tovisualize the required preventive maintenance operations within a shopfloor todetermine the optimal maintenance schedule for a production process chain

15:50-15:55 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 2 - Substrates

New Prospects for Temperature and Current Sensing for Wide Bandgap Semiconductors

15:55-16:20 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 3: Poster session - Shop Floor Innovations with Immediate Payback

Innovations to Enable Industry 4.0 for Semiconductor Process Tools

15:55-16:00 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle B1 / SEMICON EUROPA > Technology for Communication > Technology for Communication

Wireless research beyond 5G

15:55-16:15 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / PCB & EMS Speakers Corner

Cleanroom and cleanliness suitability test (TESTED DEVICE/CSM Certification)

16:00-16:30 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Dr. Frank Bürger (Fraunhofer IPA)

Vortrag / Halle B2 / Talent Stage

HACK THE FAIR - Willkommen & Vorstellung der Challenges

16:00-18:00 Uhr | Halle B2 Talent Stage, B2, booth 470

Sprecher: Ponnappa Cheranda (VDMA), Dr. Laura Dorfer (VDMA)

Keynote / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 3: Test and Reliability II

Reliability Requirements of Advanced Packaging in the Era of Electrified, Automated and Connected Driving

16:00-16:30 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Sprecher: PhD Przemyslaw Gromala (Robert Bosch GmbH, AE/ECU3)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 3: Poster session - Shop Floor Innovations with Immediate Payback

Real time compounds monitoring in clean room environment

16:00-16:05 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Produktpräsentation / Halle A3

Neue Division VCcount präsentiert zwei neue Features und führt das einmalige Worry-free Counting packag eine

16:00-16:30 Uhr | Halle A3 Booth 211

Session / Halle B1 / SEMICON EUROPA > MADEin4 Session > Digitized Electronics & Industry 4.0: The MADEin4 Initiative

Industry 4.0 Predictive Yield and Tools Performance Pilot Line for Enhanced Productivity

16:00-16:20 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 3: Poster session - Shop Floor Innovations with Immediate Payback

Poster session & Coffee break

16:05-16:45 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Vortrag / Halle B2 / Innovation Forum > Obsolescence Track

Database-driven Obsolescence Management with IHS BOM Intelligence

16:10-16:30 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Dr. Jörg Berkemeyer (IHS markit)

Presentation / Halle B1 / SEMICON EUROPA > Technology for Communication > Technology for Communication

From 4G to 6G: do the networks of the future care about the technologies of the past?

16:15-16:35 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 2 - Substrates

Germanium as an emerging strategic material for next-generation devices and applications

16:20-16:45 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Session / Halle B1 / SEMICON EUROPA > MADEin4 Session > Digitized Electronics & Industry 4.0: The MADEin4 Initiative

Industry 4.0 Digitization of Manufacturing for Enhanced Productivity

16:20-16:40 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Vortrag / Halle B2 / Innovation Forum > Obsolescence Track

An agile and digital approach to manage obsolescence

16:30-16:50 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Dr. Wolfgang Heinbach (D+D+M Daten- und Dokumentations-Management GmbH & Co. KG)

Vortrag / PCB & EMS Speakers Corner

An enhanced graphite metallization process

16:30-17:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Dr. Frank Brüning (Atotech Deutschland GmbH)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 3: Test and Reliability II

Chip Package Interaction Test structure design to address challenges from products with RF specific back end of line metallization options on Flip Chip ETS substrate

16:30-16:55 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Session / Halle B2 / SEMICON EUROPA > SMART Workforce > Career Café

16:30-17:00 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Presentation / Halle B1 / SEMICON EUROPA > Technology for Communication > Technology for Communication

5G's impact on RF Front-End: from Telecom Infrastructure to Hand sets

16:35-17:00 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Session / Halle B1 / SEMICON EUROPA > MADEin4 Session > Digitized Electronics & Industry 4.0: The MADEin4 Initiative

Closing remarks

16:40-16:45 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 2 - Substrates

Quality control in sapphire production: From automated defect detection to big data approach.

16:45-17:10 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 3: Poster session - Shop Floor Innovations with Immediate Payback

Voting for best poster with lucky draw for the audience

16:45-17:00 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Vortrag / Halle B2 / Innovation Forum > Obsolescence Track

Assurance of the long-term availability of EOL (end of life) components through specific storage methods

16:50-17:10 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Dipl.-Ing. (TU) Holger Krumme (HTV Halbleiter-Test & Vertriebs-GmbH)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 3: Test and Reliability II

Effect of harsh temperature ramp rates on solder joints of Wafer-Level CSPs in board level reliability tests.

16:55-17:20 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 4: Looking outside of the Box

17:00-17:05 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Networking / Halle B2 / SEMICON EUROPA > SMART Workforce > SEMI Networking Hour

SEMI Networking Hour

17:00-18:30 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Presentation / Halle B1 / SEMICON EUROPA > Technology for Communication > Technology for Communication

Closing remarks

17:00-17:05 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 4: Looking outside of the Box

From now on everybody is #Agile, or what?

17:05-17:35 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 2 - Substrates

Recent advancements in tailor-made silicon substrate manufacturing

17:10-17:35 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Vortrag / Halle B2 / Innovation Forum > Obsolescence Track

Electronic Marketreport Q4 2019

17:10-17:30 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Anke Bartel (Velocity Electronics GmbH)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 3: Test and Reliability II

Holistic Approach to Improve the Reliability of Advanced Heterogeneous Packaging by Chemistry

17:20-17:45 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Break / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 2 - Substrates

17:35-17:40 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Fab Management Forum > Session 4: Looking outside of the Box

17:35-17:40 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 3: Test and Reliability II

Board Level Reliability results for a two side molded WLCSP

17:45-18:10 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Networking / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 3: Test and Reliability II

Networking Reception

18:10-18:20 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Evening Event / SEMICON EUROPA > SEMICON Europa 2019 Networking Night > SEMICON Europa 2019 Networking Night

SEMICON Europa 2019 Networking Night

19:30-23:30 Uhr | Hotel Bayerischer Hof

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 3 - Power

09:00-09:10 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 4: New Materials and Processing in Packaging

09:00-09:10 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Presseveranstaltung

Presseveranstaltung OTTO-CHEMIE

09:00-17:00 Uhr | Halle B2, Standnr. 321

Keynote / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 4: New Materials and Processing in Packaging

Advanced Assembly Materials for Enabling Heterogeneous Integration and System-in-Package (SiP) Applications

09:10-09:40 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Sprecher: Ramachandran Trichur (Henkel Corporation)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 3 - Power

Challenges for Cu-Metallization in More than Moore Applications

09:10-09:40 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Transportation Forum > Welcome & Introduction

09:30-09:35 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Vortrag / PCB & EMS Speakers Corner

Paradigmenwechsel in der EMS Industrie in Europa

09:30-10:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Dieter G. Weiss (Weiss Engineering)

Presseveranstaltung / Halle A4

Pressegespräch Rehm Thermal Systems

09:30-10:30 Uhr | Halle A4 Booth 335 - Rehm Thermal Systems

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Transportation Forum > Welcome & Introduction

Global GAAC overview

09:35-09:55 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 4: New Materials and Processing in Packaging

Low Phosphorus Content Of Electroless-Ni for Power Device

09:40-10:05 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 3 - Power

09:40-10:05 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Transportation Forum > Welcome & Introduction

How next generation cars will impact the automotive industry?

09:55-10:15 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Session / Halle B2 / SEMICON EUROPA > SMART MedTech > SMART MedTech Welcome

10:00-10:05 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Cassandra Melvin (SEMI Europe)

Roundtable / Halle A1 / productronica Forum

Round Table: Factory Logistics - How to make your factory more efficient and save money

10:00-10:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Vortrag / PCB & EMS Speakers Corner

Vorstellung der Bauelemente-Technologie-Roadmap

10:00-11:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Dr. Andreas Lock (Robert Bosch GmbH)

Session / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > SCREEN - Solutions for differentiating Nanoelectronics in Europe

Session 1. More than Moore, Power, Beyond CMOS

10:00-10:50 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > SCREEN - Solutions for differentiating Nanoelectronics in Europe

Introduction and Welcome

10:00-10:10 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Sprecher: Dr. Martin Hollfelder

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Standards Meeting

Compound Semiconductor Materials (TF & TC)

10:00-13:00 Uhr | ICM - Internationales Congress Center München ICM Room 12b, 1st Floor

Presseveranstaltung / Halle A2

Pressegespräch

10:00-11:30 Uhr | Halle A2 Stand A2-540 Clustergemeinschaftsstand

Vortrag / Halle B2 / Talent Stage

productronica Fast Forward - Welcome speech

10:00-10:10 Uhr | Halle B2 Talent Stage, B2, booth 470

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 4: New Materials and Processing in Packaging

Suitable Total Process Integration of Plasma Dicing for Each Device Category

10:05-10:30 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 3 - Power

Influence of Chemical Copper Surface Treatments on the Mechanical Reliability and Failure Modes in Heterogeneous Integration Packages

10:05-10:30 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > Global Perspectives in Healthcare

From Disease Care to Health Care

10:05-10:30 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Vortrag / Halle B2 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Market Briefing

2019 Semiconductor Fab, Equipment and Materials Market: Have we reached the bottom of this cycle?

10:05-10:35 Uhr | Halle B2 Tech Arena 1, Booth B1.175

Sprecher: Lara Chamness (SEMI, Industry Research and Statistics)

Start-up Pitch / Halle B2 / Talent Stage

productronica Fast Forward - Start-up Pitches

10:10-11:30 Uhr | Halle B2 Talent Stage, B2, booth 470

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Transportation Forum > Session 1: Automotive Roadmap to 2030

10:15-10:20 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Vortrag / Halle B2 / Innovation Forum

Automatisierte Stammdatenpflege (PCN, EOL, REACH, RoHS, etc.) für alle Bauteile und Best-Price Recherche

10:30-11:00 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Helmut Krautwurm (Bay-Soft GmbH)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > Global Perspectives in Healthcare

Perspectives on Healthcare, the Medtech Industry, and Digital

10:30-10:55 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Roundtable / Halle A1 / productronica Forum

Round Table: AI - who is leading the technology and who is influencing it?

10:30-11:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 4: New Materials and Processing in Packaging

Addressing Impact of Shrinking Line/Space Dimensions on PR Strip, UBM/RDL Etch and Wafer Thinning Processes

10:30-10:55 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 3 - Power

10:30-10:55 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Vortrag / Halle B3

Hochohm-Widerstandsmessungen und Ihre Aussagekraft

10:30-11:00 Uhr | Halle B3 Stand 172, Stat-X ESD-Komptenzzentrum

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Transportation Forum > Session 1: Automotive Roadmap to 2030

Electrification: HW, SW and boundaries requirements

10:40-11:00 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > Global Perspectives in Healthcare

Connected Health for a Bright Future

10:55-11:20 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Navid Shahriari (imec, Connected Health Solutions)

Break / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 4: New Materials and Processing in Packaging

10:55-11:30 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Break / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 3 - Power

10:55-11:30 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Transportation Forum > Session 1: Automotive Roadmap to 2030

Design solution for future Automotive applications

11:00-11:20 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Vortrag / Halle B2 / Innovation Forum

Automating Automation: how software will drive the next manufacturing revolution

11:00-11:30 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Brian Mathews (Bright Machines)

Vortrag / Halle A1 / productronica Forum

Advances in Benchtop Fluid Dispensing: More Process Control at Your Fingertips

11:00-11:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Vladimir Konopelko

Presseveranstaltung

LPKF Fachpressekonferenz "We enable innovation" - Innovationen für die Elektronikbranche

11:00-13:00 Uhr | Konferenzraum Pressezentrum West

Vortrag / Halle B3 / PCB & EMS Speakers Corner

Automated Point Soldering

11:00-11:30 Uhr | Halle B3 PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Gerald Gardener

Produktpräsentation / Halle A1

Präsentation von "Complete Optical Repair Solution" (CORS)

11:00-11:30 Uhr | Halle A1 Am Digitaltest-Stand Halle A1/152

Session / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > SCREEN - Solutions for differentiating Nanoelectronics in Europe

Session 2. SCREEN R&D and JDP Collaboration

11:10-11:50 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Break / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Transportation Forum > Session 1: Automotive Roadmap to 2030

11:20-11:50 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > Global Perspectives in Healthcare

Bridging the Gap from Semiconductors to Medical Technologies: GE Research Advances in Multiparameter Gas, Physiological, and Biological Sensing

11:20-11:45 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Vortrag / Halle B3 / PCB & EMS Speakers Corner

Technische Sauberkeit

11:30-12:00 Uhr | Halle B3 PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Dr. Helmut Schweigart (ZESTRON Europe ...a Business Division of Dr. O.K. Wack Chemie GmbH)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 5: Advanced Packaging

Mechanical Debonding for ultrathin chiplet manufacturing

11:30-11:55 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Manufacturing I (software-centric)

Why is everyone talking about scheduling their fabs?

11:30-11:50 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Vortrag / Halle B2 / Innovation Forum

Industry 4.0 - How we Transform a Buzz-word into Manufacturing Excellence in Electronics

11:30-12:00 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Sagi Reuven (Siemens Mentor)

Vortrag / Halle B2 / Talent Stage

Zusammenarbeit von Startup und Maschinenbau - Realität oder Utopie?

11:30-12:00 Uhr | Halle B2 Talent Stage, B2, booth 470

Sprecher: Dr. Laura Dorfer (VDMA Startup-Machine)

Vortrag / Halle A1 / productronica Forum

The next RF probing challenge: IoT and 5G

11:30-12:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Alexander Thaler

Keynote / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 4 - Future Outlook

Lithography Enabling Industry’s Roadmap

11:30-12:00 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Break / Halle B2 / SEMICON EUROPA > SMART MedTech > Global Perspectives in Healthcare

11:45-12:15 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Session / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > SCREEN - Solutions for differentiating Nanoelectronics in Europe

Session 3. Equipment Presentation

11:50-12:30 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Manufacturing I (software-centric)

Horizontal Communication (HC) and Mount Assembler Smart Hookup (SMASH)

11:50-12:10 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: O. Fumiyasu (Siemens)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Transportation Forum > Session 2: Comprehensive Overview on Disruptive Technology Requirements for Smart Driving

11:50-11:55 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Transportation Forum > Session 2: Comprehensive Overview on Disruptive Technology Requirements for Smart Driving

Overview of the Automotive market and future challenges from memory perspectives

11:55-12:15 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 5: Advanced Packaging

Innovative Panel Plating for finer line spacing and better uniformity to allow semiconductor or embedded die assembly for Heterogeneous Integration

11:55-12:20 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Roundtable / Halle A1 / productronica Forum

Round Table: Strategien für die optimale Baugruppeninspektion: Wie hoch muss der Inspektionsaufwand sein, um eine dauerhafte Sicherung der Fertigungsqualität elektronischer Baugruppen zu gewährleisten? Experten von ATEcare, Göpel Electronic, Viscom und Zollner Elektronik geben Auskunft

12:00-13:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Vortrag / Smart Maintenance Pavillon / mfa

Rollout von Remote Expert Support Lösungen - Herausforderungen und Erfolgsfaktoren

12:00-13:00 Uhr | Smart Maintenance Pavillon, Halle B2 Standnr. 133

Vortrag / Halle B3 / PCB & EMS Speakers Corner

CAPE - Clean And Protective Environment

12:00-12:30 Uhr | Halle B3 PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Dr. Frank Bürger (Fraunhofer IPA)

Vortrag / Halle B2 / Innovation Forum

Secure Programming for the Automotive World: Securing the Connected Car with Hardware Based Security for a Flexible and Secure Manufacturing Strategies

12:00-12:30 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Anthony Ambrose (Data I/O GmbH)

Workshop / Halle B2 / Talent Stage

Von der Idee zur Serienproduktion

12:00-13:30 Uhr | Halle B2 Talent Stage, B2, booth 470

Sprecher: Start A Factory

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 4 - Future Outlook

The use of chemicals in the Semi conductor industry and the regulatory requirements or concerns

12:00-12:30 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Manufacturing I (software-centric)

5G for industrial Applications

12:10-12:30 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: Karin Loidl (Fraunhofer-Institut für Integrierte Schaltungen IIS)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > The Digitization of Preventive Healthcare

Digital Health: Tracking Mental Stress and Mood Using Wearable Data and Machine Learning

12:15-12:40 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: PhD Emmanuel Rios Velazquez (OnePlanet | Connected Health Solutions)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Transportation Forum > Session 2: Comprehensive Overview on Disruptive Technology Requirements for Smart Driving

Trends in Automotive: Fab Inspection and Metrology Changing Role in “Zero Defect”

12:15-12:35 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 5: Advanced Packaging

Advanced Plasma Surface Activation for Hybrid Fusion Bonding

12:20-12:45 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Vortrag / Halle B2 / Innovation Forum

38link and industry 4.0: Harmonizing Quality Inspections with Efficient Data Management

12:30-13:00 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Rod Matheson (OLYMPUS EUROPA SE & Co. KG)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 4 - Future Outlook

Temperature-dependent thermal properties of nm-thin Nb2O5 using a novel thermal impedance approach

12:30-12:55 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Vortrag / PCB & EMS Speakers Corner

Stencil Printing 008004/0201 Aperture Components

12:30-13:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Michael Butler, Edward Nauss

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Manufacturing I (software-centric)

Democratizing AI to accelerate the journey towards smart manufacturing

12:30-12:50 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: Ingo Kobusch (IBM Services)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Transportation Forum > Session 2: Comprehensive Overview on Disruptive Technology Requirements for Smart Driving

A new collaborative approach to defectivity challenges in the automotive industry

12:35-12:55 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > The Digitization of Preventive Healthcare

Monitoring Sleep to Prevent Health Issues and Costs

12:40-13:05 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Sudhir Mulpuru (Maxim Integrated)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 5: Advanced Packaging

Packaging of a MOEMS LIDAR sub assembly for distance metering on a 3D housing

12:45-13:10 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Disruptive Computing

Diamond for Quantum Computing

12:45-13:05 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Manufacturing I (software-centric)

Long way to visibility - IoT as enabler for full transparency along the supply chain

12:50-13:10 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: Florian Kemmerling (DBschenker)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Transportation Forum > Session 2: Comprehensive Overview on Disruptive Technology Requirements for Smart Driving

What you should expect from Smart Manufacturing/Industry 4.0

12:55-13:15 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 4 - Future Outlook

12:55-13:20 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Vortrag / Halle A1 / productronica Forum

Coherent - we cover your laser applications from A (additive manufacturing) to W (welding of dissimilar materials Dr. Roland Mayerhofer, Co

13:00-13:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Dr. Roland Mayerhofer

Vortrag / PCB & EMS Speakers Corner

New quality test for susceptibility of encapsulated electronics to harmful gas corrosion and humidity

13:00-13:30 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Dr. Markus Meier (Zestron ...a business division of Dr. O.K. Wack Chemie GmbH Sonderschau Cleaning & Contamination Testing Center)

Vortrag / Halle B2 / Innovation Forum

Infra-Red Temperature Process Monitoring for Underfill Applications

13:00-13:30 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Sunny Agarwal (ITW EAE)

Workshop / Smart Maintenance Pavillon / mfa

Angewandte Kryptographie für Embedded Entwickler und Hardware-Ingenieure

13:00-14:00 Uhr | Smart Maintenance Pavillon, Halle B2 Standnr. 133

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Disruptive Computing

Disruptions Ahead – Hearings Instruments as Multi-Sensor Platforms

13:05-13:25 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > The Digitization of Preventive Healthcare

Sensors to Enable Consumer Health Applications

13:05-13:30 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: PhD Filip Frederix (ams, INS)

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 5: Advanced Packaging

Half-inch FOWLP Process Line utilizing Minimal FAB

13:10-13:35 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Manufacturing I (software-centric)

Cyber-Physical Human-in-the-Loop Systems for manufacturing: exploring the border between learning and control

13:10-13:30 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: Giovanni Russo (University College Dublin, School of Electrical and Electronic Engineering)

Break / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Transportation Forum > Session 2: Comprehensive Overview on Disruptive Technology Requirements for Smart Driving

13:15-14:15 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 4 - Future Outlook

13:20-13:45 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Disruptive Computing

Enablement of Energy-efficient Machine Learning hardware through System-Technology Co-optimization

13:25-13:45 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / Halle A1 / productronica Forum

Best Practices for X-ray Inspection, Reflow and the Impact of Pre-programmed Managed-NAND devices

13:30-14:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Anthony Ambrose (Data I/O GmbH)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > The Digitization of Preventive Healthcare

Can Wearables Help Prevent the Silent Killer (BP)?

13:30-13:55 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Alisher Kholmatov (Maxim Integrated)

Vortrag / Halle B2 / Innovation Forum > Printed Electronics Insights: Smart Living

Introduction to Printed Electronics

13:30-13:40 Uhr | Halle B2 Innovation Forum, B2, booth 441

Vortrag / PCB & EMS Speakers Corner

Artifical Intelligence and Machine Learning in Production Environment

13:30-14:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Martin Schleef (Fraunhofer IPA)

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Advanced Packaging Conference > Session 5: Advanced Packaging

Closing Remarks & End

13:35-13:45 Uhr | ICM - Internationales Congress Center München ICM Room 13b, 1st Floor

Vortrag / Halle B2 / Innovation Forum > Printed Electronics Insights: Smart Living

Roll to Roll Manufacture of Flexible Multi-component Electronics Assemblies

13:40-14:00 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Dr. Simon Johnson (CPI Centre for Process Innovation Ltd.)

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Disruptive Computing

Silicon for large scale quantum computing

13:45-14:05 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Presentation / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 4 - Future Outlook

Closing remarks

13:45-14:00 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Vortrag / Halle B2 / Innovation Forum > Printed Electronics Insights: Future of Mobility

Saving the world, one cable harness at time

14:00-14:20 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Tommi Rintala (NewCable Corporation)

Workshop / Halle A2

Kleine EMS-Betriebe und die große Digitalisierung

14:00-15:30 Uhr | Halle A2 Stand 540

Vortrag / Halle B2 / Talent Stage

Allgemeine Hardware-Startup-Fallen und wie man sie vermeidet

14:00-15:00 Uhr | Halle B2 Talent Stage, B2, booth 470

Sprecher: Niclas Fritz (BatchOne)

Session / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > MEMS along the Value Chain

14:00-14:05 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Vortrag / Halle B2 / Talent Stage

Common Hardware Startup Pitfalls and how to avoid them

14:00-15:00 Uhr | Halle B2 Talent Stage, B2, booth 470

Sprecher: Niclas Fritz (BatchOne GmbH)

Vortrag / Halle B2 / Innovation Forum > Printed Electronics Insights: Smart Living

Roll-to-Roll production of printed electronics

14:00-14:20 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Sebastian Stehlin (InnovationLab GmbH)

Vortrag / Halle A1 / productronica Forum

Manufacturing excellence – material flow from PLM to process engineering

14:00-14:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Nir Benson

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Standards Meeting

Silicon Wafer (TC)

14:00-16:00 Uhr | ICM - Internationales Congress Center München ICM Room 12a, 1st Floor

Presseveranstaltung

Presseveranstaltung Cluster Mechatronik

14:00-14:30 Uhr | Halle A2, Standnr. 540

Break / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Strategic Materials Conference > Session 4 - Future Outlook

14:00-14:05 Uhr | ICM - Internationales Congress Center München ICM Room 13a, 1st Floor

Vortrag / PCB & EMS Speakers Corner

Traceability ist die Basis zur erfolgreichen Umsetzung der digitalen Transformation

14:00-14:30 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Alois Mahr (Zollner Elektronik AG)

Presseveranstaltung

Pressetermin ZVEI 13. November 2019

14:00-15:00 Uhr | Konferenzraum Pressezentrum West

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Disruptive Computing

Ambipolar quantum dots in planar silicon

14:05-14:25 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > MEMS along the Value Chain

Factors Affecting the Market Landscape for Sensors

14:05-14:25 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Panel / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Transportation Forum > Enabling Autonomous Driving Panel Discussion

Panel Discussion:Enabling Autonomous Driving

14:15-15:30 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > Revolutionizing Healthcare with Personalized Medicine

Personalized Medicine: Toward Innovative Solutions to Meet Healthcare Challenges

14:15-14:40 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Jerome Mouly (Yole Développement)

Vortrag / Halle B2 / Innovation Forum > Printed Electronics Insights: Smart Living

High volume roll-to-roll production of wearable sensor for smarter living experience

14:20-14:40 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Prof. Jukka Hast (VTT - Technical Research Centre of Finland Ltd.)

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Disruptive Computing

Advances in Energy Efficient Neuromorphic Computing: Ready for Artificial Intelligence at the Edge?

14:25-14:45 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > MEMS along the Value Chain

A Roadmap for the future inline control and yield management in MEMS production

14:25-14:45 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Workshop / Halle B3

Einsatzmöglichkeiten des Begehtestsystems im ESD-Schutz

14:30-15:00 Uhr | Halle B3 Stand 172, Stat-X ESD-Komptenzzentrum

Vortrag / Halle A1 / productronica Forum

Industry 4.0 for Test: Improve Operational Efficiency with New Technology for Centralized Test Station and Data Management

14:30-15:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Lax Madapaty

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > ESiPAT > ESiPAT

14:30-17:30 Uhr | ICM - Internationales Congress Center München ICM Room 14a, 1st Floor

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > Revolutionizing Healthcare with Personalized Medicine

Personalised Health Management Enabled by Nanotechnology and Laboratory on a “Chip” Products

14:40-15:05 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Ronny van’t Oever (Micronit Microtechnologies BV)

Vortrag / Halle B2 / Innovation Forum > Printed Electronics Insights: Smart Living

Printed and embedded systems for smart RFID labels with wireless energy charging

14:40-15:00 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Roberto Laranjeira (Centi - Centre for Nanotechnoloy & Smart Materials)

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > MEMS along the Value Chain

Pushing the Limits: Recent Advancements in the Optical Characterization of MEMS Devices

14:45-15:05 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Disruptive Computing

14:45-14:50 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / Halle B2 / Innovation Forum > Printed Electronics Insights: Smart Living

Potential of Printed Batteries for Internet of Things Applications

15:00-15:20 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Prof. Dr. Ulrich Moosheimer (Munich University of Applied Sciences)

Roundtable / PCB & EMS Speakers Corner

Cloud, Big Data, KI, Robotik & Co: Wie viel Digitalisierung braucht die EMS-Industrie?

15:00-16:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Session / Halle B1 / SEMICON EUROPA > Member session: SEMI: Delivering Member Value > SEMI: DELIVERING MEMBER VALUE

Contact Protocol & Welcome

15:00-15:10 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / Smart Maintenance Pavillon / mfa

Neue Möglichkeiten zur automatischen Qualitätssicherung durch künstliche Intelligenz

15:00-16:00 Uhr | Smart Maintenance Pavillon, Halle B2 Standnr. 133

Roundtable / Halle B2 / Talent Stage

Märkte und Karrieren im Wandel

15:00-16:00 Uhr | Halle B2 Talent Stage, B2, booth 470

Sprecher: Dr. Michael Schanz (VDE (Verband der Elektrotechnik Elektronik und Informationstechnik)), Michael Köhler (SchuhEder Consulting GmbH), Holger Schötz (Rohde & Schwarz GmbH & Co. KG), Michael Lupbrand (Steca Elektronik GmbH)

Vortrag / Halle A1 / productronica Forum

Smart Manufacturing And A Connected Shopfloor - The Status Quo Of A Brave New World in 2019

15:00-15:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: David Rogers (Siemens AG)

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Connecting Korean Suppliers and European Customers

Opening Remarks

15:00-15:05 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Sprecher: Laith Altimime (SEMI Europe)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > Revolutionizing Healthcare with Personalized Medicine

Innovative Diagnostics

15:05-15:30 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Prof. Joachim Wegner (University of Regensburg)

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > MEMS along the Value Chain

Thermal Treatments in MEMS Fabrication:Challenges and Benefits of Rapid Thermal Processing (RTP)

15:05-15:25 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Connecting Korean Suppliers and European Customers

European Fabs´ Status Overview - FMF Committee Chair

15:05-15:25 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Sprecher: Thomas Richter (Robert Bosch GmbH)

Presentation / Halle B1 / SEMICON EUROPA > Member session: SEMI: Delivering Member Value > SEMI: DELIVERING MEMBER VALUE

2019 & 2020 Semiconductor Equipment and Materials Market: Where are we headed?

15:10-15:30 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / Halle B2 / Innovation Forum > Printed Electronics Insights: Smart Living

From Printtronic to assembly on flex

15:20-15:40 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Christian Daschner (db-matik AG)

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > MEMS along the Value Chain

New technology for inhalers and sprays for a healthier world

15:25-15:45 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Connecting Korean Suppliers and European Customers

NEXTIN Inspection System

15:25-15:40 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Sprecher: Harald Moder (merconics - official distributor of Nextin in Europe)

Vortrag / Halle A1 / productronica Forum

Business Outlook: Global Electronics Industry (with emphasis on Europe)

15:30-16:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Walter Custer (Custer Consulting Group)

Panel / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > SMART Transportation Forum > Enabling Autonomous Driving Panel Discussion

15:30-15:35 Uhr | ICM - Internationales Congress Center München ICM Room 14c, 1st Floor

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > Revolutionizing Healthcare with Personalized Medicine

Precise Drug Delivery for Personalized Healthcare

15:30-15:55 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Martin Richter (Fraunhofer EMFT)

Session / Halle B1 / SEMICON EUROPA > Member session: SEMI: Delivering Member Value > SEMI: DELIVERING MEMBER VALUE

What to Expect from SEMI in 2020

15:30-15:45 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / Halle B2 / Innovation Forum

K&S introduces SlimFit Feeder concept, a smart Feeder with highest possible part number density

15:40-16:10 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Marco van Oosterhout (Kulicke & Soffa Pte. Ltd.)

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Connecting Korean Suppliers and European Customers

ZEUS (Cleaning Equipment)

15:40-15:55 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Sprecher: Mark Chung (Global ZEUS)

Session / Halle B1 / SEMICON EUROPA > Member session: SEMI: Delivering Member Value > SEMI: DELIVERING MEMBER VALUE

Pioneering Talent & Diversity Initiatives for Europe

15:45-16:05 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > MEMS along the Value Chain

Cutting-edge Plasma Dicing for wafer singulation applied to MEMS devices

15:45-16:05 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Connecting Korean Suppliers and European Customers

Apple T Co., Ltd - TEL Track Used Equipment/Refurbishment & Turnkey Service

15:55-16:10 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Sprecher: Elly Kyungjin Rah (APPLE T CO., LTD)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > Revolutionizing Healthcare with Personalized Medicine

Medical is the next Automotive – the Advance of Silicon-based Microfluidics Technologies and Applications

15:55-16:20 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Dr. Stefan Ernst (X-FAB MEMS Foundry)

Workshop / Halle A1 / productronica Forum

Indian electronics market atractiveness-Focus on e-mobility

16:00-16:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Ketan Jadhav (EAC- Euro Asia Consulting Pvt. Ltd.)

Award / PCB & EMS Speakers Corner

Leserpreis BestEMS 2019

16:00-17:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Presentation / Halle B1 / SEMICON EUROPA > Member session: SEMI: Delivering Member Value > SEMI: DELIVERING MEMBER VALUE

Strategic Engagement through SEMI Technology Communities

16:05-16:20 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > MEMS along the Value Chain

Advanced black resist processing and optimized lithographic patterning for novel optical MEMS devices

16:05-16:25 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: Bozena Matuskova (EVG)

Vortrag / Halle B2 / Innovation Forum

Neueste RFA-Schichtdickenanalysegeräte für Halbleiter-Packaging im mikroskopischen Maßstab

16:10-16:40 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Johannes Eschenauer (Hitachi High-Tech Analytical Science GmbH)

Session / Halle B2 / SEMICON EUROPA > SMART MedTech > Technology Demo Zone & Networking

Technology Demo Zone & Networking

16:20-17:00 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Session / Halle B1 / SEMICON EUROPA > Member session: SEMI: Delivering Member Value > SEMI: DELIVERING MEMBER VALUE

Navigating the New Member Directory

16:20-16:45 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Connecting Korean Suppliers and European Customers

Russell - Jungho Kim

16:25-16:40 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Session / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > MEMS along the Value Chain

Closing Remarks & End

16:25-16:35 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Session / Halle ICM - Internationales Congress Center München / SEMICON EUROPA > Standards Meeting

ERSC (By Invitation Only)

16:30-18:00 Uhr | ICM - Internationales Congress Center München ICM Room 12a, 1st Floor

Vortrag / Halle A1 / productronica Forum

Indian market entry success factors

16:30-17:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Ketan Jadhav (EAC- Euro Asia Consulting Pvt. Ltd.)

Workshop / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Connecting Korean Suppliers and European Customers

Q & A and Networking

16:40-17:00 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / Halle B2 / Innovation Forum

Elisa Smart Factory - Boosting Productivity with Industrial IoT and AI

16:40-17:10 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Reiner Pes (Elisa Smart Factory)

Presentation / Halle B1 / SEMICON EUROPA > Member session: SEMI: Delivering Member Value > SEMI: DELIVERING MEMBER VALUE

SEMI Advocacy Program Helps Members Grow | An Overview of Policies Affecting the Semiconductor Manufacturing Industry

16:45-17:00 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Networking / Halle B1 / SEMICON EUROPA > Member session: SEMI: Delivering Member Value > SEMI: DELIVERING MEMBER VALUE

SEMI Networking Hour

17:00-18:00 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Session / Halle B1 / SEMICON EUROPA > Member session: SEMI: Delivering Member Value > SEMI: DELIVERING MEMBER VALUE

18:00-18:05 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM

09:00-09:30 Uhr | ICM - Internationales Congress Center München

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM

Keynote: Monitoring to Improve Health & Performance

09:30-10:15 Uhr | ICM - Internationales Congress Center München

Sprecher: Prof. Dr. Billy Sperlich (Julius-Maximilians-Universität Würzburg)

Vortrag / PCB & EMS Speakers Corner

UPS Industrial Buying Dynamics Studie 2019: Industrial buyer behaviours, preferences and perceptions in Europe

09:30-10:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Thorsten Friedrich

Vortrag / PCB & EMS Speakers Corner

PCB and EMS Market – Trends and Outlook

10:00-11:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Xaver Feiner (Zollner Elektronik AG), Michael Gasch (Data4PCB)

Roundtable / Halle B2 / Talent Stage

Education Path: Wie sichern wir zukünftig unseren Fach- und Führungskräftebedarf?

10:00-11:30 Uhr | Halle B2 Talent Stage, B2, booth 470

Sprecher: Patrick Meinhardt (BVMW - Bundesverband mittelständische Wirtschaft, Unternehmerverband Deutschlands e.V.), Prof. Dr. Klaus Kreulich (Hochschulrektorenkonferenz), Peter Schühly, Dr. Michael Stahl (Arbeitgeberverband Gesamtmetall e.V.)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > The Digital Patient: The Future of Artificial Organs & Human Avatars

Day Two Opening

10:00-10:05 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Patrick Boisseau (MedTech Europe)

Presentation / Halle B2 / SEMICON EUROPA > Exhibitor Presentations > Exhibitor Presentations

MEMS Digital Prototyping Flow

10:00-10:10 Uhr | Halle B2 TechLounge / SEMI Member Lounge Booth B2.156

Sprecher: John Stabenow (Mentor)

Presentation / Halle B2 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Building a Circular Economy in the Electronics Manufacturing Industry

10:00-10:05 Uhr | Halle B2 Tech Arena 2, Booth B1.770

Sprecher: Emir Demircan (SEMI Europe)

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Photonics

Coherent photonic transmitters: what, how and when?

10:00-10:20 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Roundtable / Halle A1 / productronica Forum

Round Table: What is the future for automotive electronics? (have we reached Peak Car?)

10:00-10:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Presentation / Halle B2 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Building a Circular Economy in the Electronics Manufacturing Industry

Building a circular economy in the electronic manufacturing industry: the perspective of a material solution supplier.

10:05-10:25 Uhr | Halle B2 Tech Arena 2, Booth B1.770

Sprecher: Carl Quaeyhaegens (Umicore, Corporate)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > The Digital Patient: The Future of Artificial Organs & Human Avatars

Human Avatars, the Next Paradigm in Healthcare

10:05-10:30 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Prof. Dr. Adrian Ionescu (EPFL, Engineering)

Vortrag / Halle B2 / SEMICON EUROPA > Exhibitor Presentations > Exhibitor Presentations

Semiconductor Smart Manufacturing: An Evolving Nexus of Business Drivers, Technologies, and Standards

10:15-10:30 Uhr | Halle B2 TechLounge / SEMI Member Lounge Booth B2.156

Sprecher: Alan Weber (Cimetrix Incorporated, Marketing)

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Photonics

Si and SiN High-Q microresonators for quantum and nonlinear optics applications

10:20-10:40 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Presentation / Halle B2 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Building a Circular Economy in the Electronics Manufacturing Industry

Transitioning to a Circular Economy in the Sub Fab Supporting EUVL

10:25-10:45 Uhr | Halle B2 Tech Arena 2, Booth B1.770

Sprecher: Tony Key (Edwards)

Roundtable / Halle A1 / productronica Forum

Round Table: Conformal Coatings - best practice techniques and applications

10:30-11:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM > Medical Device Regulation

EU Medical Device Regulation

10:30-11:00 Uhr | ICM - Internationales Congress Center München

Sprecher: Gesa Kniebühler (TÜV SÜD)

Vortrag / Halle B3

Wege und Einflussfaktoren zu elektrostatischen Aufladungen

10:30-11:00 Uhr | Halle B3 Stand 172, Stat-X ESD-Komptenzzentrum

Vortrag / Halle B2 / SEMICON EUROPA > Exhibitor Presentations > Exhibitor Presentations

Novel Group IV Epitaxial Materials

10:30-10:45 Uhr | Halle B2 TechLounge / SEMI Member Lounge Booth B2.156

Sprecher: Gerard Colston (AdvancedEPI)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > The Digital Patient: The Future of Artificial Organs & Human Avatars

The Digital Patient: Will We One Day Have our Own Health Avatar?

10:30-10:55 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: PhD Ger Janssen (Philips)

Vortrag / Halle B2 / Innovation Forum

Smart Maintenance: Neue Optimierungspotenziale in der Technik durch Digitalisierung

10:30-11:00 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Dr. Andreas Dankl (dankl+partner consulting GmbH)

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Photonics

COMMUNICATE, SENSE WITH LIGHTGenerating, Modulating, Routing, Filtering, and Detecting Light on Siliconwith Mass Manufacturable Semiconductor Integrated Circuit

10:40-11:00 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Vortrag / Halle B2 / SEMICON EUROPA > Exhibitor Presentations > Exhibitor Presentations

New York State - A Compelling Place to Make Chips

10:45-11:00 Uhr | Halle B2 TechLounge / SEMI Member Lounge Booth B2.156

Sprecher: Mark Reynolds (Strategic Business Development New York Empire State Development)

Presentation / Halle B2 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Building a Circular Economy in the Electronics Manufacturing Industry

From Resource Saving to Circular Economy

10:45-11:05 Uhr | Halle B2 Tech Arena 2, Booth B1.770

Sprecher: Jörg Winter (DAS Environmental Expert GmbH)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > The Digital Patient: The Future of Artificial Organs & Human Avatars

The Future of Personalized Treatment

10:55-11:20 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Dr. Franz Laermer (Robert Bosch GmbH Stuttgart, Corporate Sector Research & Advance Engineering, CR/AR1 CE-MST)

Roundtable / Halle A1 / productronica Forum

Panel Discussion: The 'Circular Economy' and the electronics manufacturing industry

11:00-11:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Vortrag / Halle B2 / Innovation Forum

Smart Maintenance: Digital Assistant Systems for the Shop Floor

11:00-11:30 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Thomas Bechtel (Fujitsu Technology Solutions GmbH)

Vortrag / Halle B2 / SEMICON EUROPA > Exhibitor Presentations > Exhibitor Presentations

AIM Photonics and NY CREATES at Albany Nanotech - New Research Thrusts, Initiatives and Major Projects

11:00-11:15 Uhr | Halle B2 TechLounge / SEMI Member Lounge Booth B2.156

Sprecher: LaMar Hill (NY Creates at SUNY Polytechnic)

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM > Connected Healthcare

Bridging the Digital Divide: A Practical Guide to Connected Healthcare

11:00-11:30 Uhr | ICM - Internationales Congress Center München

Sprecher: Reiner Duwe (Real-Time Innovations (RTI))

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM > Medical Device Regulation

Artificial Intelligence and MDR - Verification possible?

11:00-11:30 Uhr | ICM - Internationales Congress Center München

Sprecher: Thorsten Langenhan (AVQ)

Vortrag / PCB & EMS Speakers Corner

Printed Electronics – Pushing the Limits

11:00-11:30 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Dr. Andreas Albrecht (Cicor Group)

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Photonics

High performance photonic technologies for communication and sensing applications

11:00-11:20 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Presentation / Halle B2 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Building a Circular Economy in the Electronics Manufacturing Industry

A Circular Economy for Smartphones

11:05-11:25 Uhr | Halle B2 Tech Arena 2, Booth B1.770

Sprecher: Karsten Schischke (Fraunhofer IZM)

Vortrag / Halle B2 / SEMICON EUROPA > Exhibitor Presentations > Exhibitor Presentations

Automation of Silicon Photonics PDK and Test Chips

11:15-11:30 Uhr | Halle B2 TechLounge / SEMI Member Lounge Booth B2.156

Sprecher: John Stabenow (Mentor)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > The Digital Patient: The Future of Artificial Organs & Human Avatars

The Clinician’s Point of View

11:20-11:45 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Prof. Anthony Mathur (Barts Heart Centre & Queen Mary University of London)

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Photonics

Micron-scale low-loss silicon photonics for communication and sensing

11:20-11:40 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Presentation / Halle B2 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Building a Circular Economy in the Electronics Manufacturing Industry

Topic TBA European Commission (TBC)

11:25-11:50 Uhr | Halle B2 Tech Arena 2, Booth B1.770

Vortrag / PCB & EMS Speakers Corner

Creating customer value with automated DFM in digital industrialization chain

11:30-12:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Michael Hendrix (Lacroix Electronics)

Vortrag / Halle B2 / Innovation Forum

Dynamic limits via machine learning- modern "health monitoring" for all appliances, machines and plants.

11:30-12:00 Uhr | Halle B2 B2, booth 441

Sprecher: Randolph Sternberg (algorithmica technolgies GmbH)

Vortrag / Halle A1 / productronica Forum

Implementation of a low melting point soldering alloy in electronics assembly

11:30-12:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Steven Teliszewski

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM

Keynote: Living with a Bionic Hand

11:30-12:00 Uhr | ICM - Internationales Congress Center München

Sprecher: Michel Fornasier (aka Bionicman)

Presentation / Halle B2 / Innovation Forum

Smart Maintenance: Produktionsoptimierung durch maschinelles Lernen

11:30-12:00 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Randolph Sternberg (algorithmica technolgies GmbH)

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Photonics

Foundry model for low-cost versatile photonic integrated circuits

11:40-12:00 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Panel / Halle B2 / SEMICON EUROPA > SMART MedTech > The Digital Patient: The Future of Artificial Organs & Human Avatars

Panel discussion: Key Drivers Transforming Healthcare: AI, Big Data and Cyber Security

11:45-12:30 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Presentation / Halle B2 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Building a Circular Economy in the Electronics Manufacturing Industry

11:50-12:00 Uhr | Halle B2 Tech Arena 2, Booth B1.770

Sprecher: Emir Demircan (SEMI Europe)

Workshop / Halle B2 / Talent Stage

Die Supply Chain: das unbekannte Wesen

12:00-13:30 Uhr | Halle B2 Talent Stage, B2, booth 470

Sprecher: Start A Factory

Vortrag / Halle A1 / productronica Forum

Localization in Russia: Key Factors to drive your business

12:00-12:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Sergei Belyakov

Session / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Photonics

12:00-12:05 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Vortrag / PCB & EMS Speakers Corner

Are Conformal Coatings a Must in the Production of Electronics? Technologies, Functions, Efficiency and Future

12:00-12:30 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Michael Kolassa (Lackwerke Peters)

Vortrag / Halle B2 / Innovation Forum

Smart Maintenance: IoT Sensoren für smarte Digitalisierung und Digital Twins

12:00-12:30 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Dipl.-Ing. Dorly Holzer-Harringer (Almendo Technologies GmbH)

Presentation / Halle B2 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Manufacturing II (hardware-centric)

Wafer-Level Package handling and inspection/metrology platform

12:15-12:40 Uhr | Halle B2 Tech Arena 2, Booth B1.770

Sprecher: Thomas Brillouet (RECIF Technologies)

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > From Quantum Computing to NewSpace: Innovations from the Finnish Semiconductor Ecosystem

Session Opening Remarks

12:15-12:20 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: Laith Altimime (SEMI Europe)

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > From Quantum Computing to NewSpace: Innovations from the Finnish Semiconductor Ecosystem

Overview of VTT Ltd and its Role in the Finnish Electronics Innovation - Examples

12:20-12:40 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: Antti Vasara (VTT Ltd.)

Vortrag / Halle B2 / Innovation Forum

Smart Maintenance: Neue Möglichkeiten zur automatischen Qualitätssicherung durch künstliche Intelligenz

12:30-13:00 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Jonas Schaub (elunic AG)

Vortrag / Halle A1 / productronica Forum

Balancing your Test Stategy to Deliver the Value your Business Expects... and Keep Your Engineers Happy!

12:30-13:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Graham Green

Vortrag / PCB & EMS Speakers Corner

UFS Memory Trend and its Data Programming Methodologies in the Factory

12:30-13:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Chong Tsao (Dediprog Technology Co., Ltd.)

Break / Halle B2 / SEMICON EUROPA > SMART MedTech > The Digital Patient: The Future of Artificial Organs & Human Avatars

12:30-13:25 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Presentation / Halle B2 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Manufacturing II (hardware-centric)

Smart Manufacturing setups to achieve an AI based Digital Transmission within the EMS-industry

12:40-13:05 Uhr | Halle B2 Tech Arena 2, Booth B1.770

Sprecher: Markus M. Hoffmann (Zollner Elektronik)

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > From Quantum Computing to NewSpace: Innovations from the Finnish Semiconductor Ecosystem

NewSpace: New Opportunities

12:40-12:55 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: Tauno Vähä-Heikkilä (VTT Ltd.)

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > From Quantum Computing to NewSpace: Innovations from the Finnish Semiconductor Ecosystem

Cryogenics role in quantum technology

12:55-13:10 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: David Gunnarsson (Bluefors Oy)

Vortrag / PCB & EMS Speakers Corner > Movers of the Green Factory in Industry 4.0 – AGVs, Mobile Robots and Wireless Energy Transfer

On the Move - Smart Vehicles and Wireless Energy for Green Factories

13:00-13:05 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Alexander M. Schmoldt (Murata Manufacturing Co., Ltd.)

Roundtable / Halle A1 / productronica Forum

Round Table: Gibt es das optimale 3D AOI Inspektionssystem für hohe Qualität und Flexibilität?

13:00-14:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM > Chronic Diseases

A Novel Wearable Device for Monitoring Lung Function from Tidal Breathing

13:00-13:30 Uhr | ICM - Internationales Congress Center München

Sprecher: Prof. Dr. Wieland Voigt (Nanovation-GS)

Roundtable / Innovation Forum

Panel discussion: The future of diversity and inclusion in technology & manufacturing

13:00-13:30 Uhr | Innovation Forum, B2, booth 441

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM > Big Data

5G and Healthcare: Real World Performance Data on 5G Shows Potential in Healthcare

13:00-13:30 Uhr | ICM - Internationales Congress Center München

Sprecher: Roeen Roashan (IHS Markit)

Vortrag / Halle B2 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Manufacturing II (hardware-centric)

Smart Manufacturing for Packaging Industry

13:05-13:30 Uhr | Halle B2 Tech Arena 2, Booth B1.770

Sprecher: James Song (Asml)

Vortrag / PCB & EMS Speakers Corner > Movers of the Green Factory in Industry 4.0 – AGVs, Mobile Robots and Wireless Energy Transfer

The Right Chemistry - Batteries Empowering Safe AGVs and Mobile Robots

13:10-13:30 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: E. Miguez (Murata Electronics)

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > From Quantum Computing to NewSpace: Innovations from the Finnish Semiconductor Ecosystem

Smart Molded Structures

13:10-14:00 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: Antti Keränen (Tactotek Group)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > Pioneering Research in Medical Technologies

CMOS Compatible SiN Technology Platform for Life Science Applications

13:25-13:45 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Andim Stassen (imec, Life Science Technologies)

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > From Quantum Computing to NewSpace: Innovations from the Finnish Semiconductor Ecosystem

Spectral Imaging Cameras with Application Examples

13:25-13:40 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: Juha Kalliopuska (Advacam Ltd)

Vortrag / Halle B2 / Innovation Forum > Printed Electronics Insights: Future of Mobility

Introduction to Printed Electronics

13:30-13:40 Uhr | Halle B2 Innovation Forum, B2, booth 441

Presentation / Halle B2 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Manufacturing II (hardware-centric)

Automate#LikeABosch – BOSCH’s path to entire Fab Automation

13:30-13:55 Uhr | Halle B2 Tech Arena 2, Booth B1.770

Sprecher: Heinz Martin (Fabmatics)

Vortrag / Smart Maintenance Pavillon / mfa

Industrie 4.0 - Fluch oder Segen?

13:30-14:00 Uhr | Smart Maintenance Pavillon, Halle B2 Stand 133

Sprecher: Michael Olsacher (dankl+partner consulting GmbH)

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM > Big Data

Challenge Big Data in Biomedicine: Long-term High-Resolution Impedance Manometry (LTHRIM) of the Esophagus

13:30-14:00 Uhr | ICM - Internationales Congress Center München

Sprecher: Dr. Alissa Jell (Klinikum rechts der Isar)

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM > Chronic Diseases

Lecture of Peter Ferguson

13:30-14:00 Uhr | ICM - Internationales Congress Center München

Sprecher: Peter Ferguson (Arm)

Vortrag / PCB & EMS Speakers Corner > Movers of the Green Factory in Industry 4.0 – AGVs, Mobile Robots and Wireless Energy Transfer

Smart Agents - AGVs On the Move to Seamless and Efficient Processes

13:35-13:55 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: S. Behounek (SAFELOG)

Vortrag / Halle B2 / Innovation Forum > Printed Electronics Insights: Future of Mobility

Printed Electronics: Untapped opportunities across domains in India

13:40-14:00 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Dr. Ashok Sridhar (Classic Stripes Private Limited)

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > From Quantum Computing to NewSpace: Innovations from the Finnish Semiconductor Ecosystem

AI Application Use Cases

13:40-13:55 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: Tomi Räty (VTT Ltd.)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > Pioneering Research in Medical Technologies

Microfluidic, CMOS Microelectrode Array-based Organ-on-chip System: a Platform for Personalized Medicine

13:45-14:05 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: PhD Thomas Pauwelyn (imec, Life Science Technologies)

Vortrag / Halle B2 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Manufacturing II (hardware-centric)

Practical Machine Learning for Tools

13:55-14:25 Uhr | Halle B2 Tech Arena 2, Booth B1.770

Sprecher: Doug Suerich (PEER Group)

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > From Quantum Computing to NewSpace: Innovations from the Finnish Semiconductor Ecosystem

Closing remarks

13:55-14:00 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: Antti Vasara (VTT Ltd.)

Vortrag / Halle A1 / productronica Forum

Human Automation: Hands-Free Industry 4.0

14:00-14:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Michael Ford (Aegis Industrial Software Corporation)

Keynote / Halle A2

Franka Emika: Robots for Everyone

14:00-14:30 Uhr | Halle A2 Stand 540

Vortrag / Smart Maintenance Pavillon / mfa

Dynamic limits via machine learning - modern "health monitoring" for all appliances, machines and plants

14:00-15:00 Uhr | Smart Maintenance Pavillon, Halle B2, Standnr. 133

Vortrag / PCB & EMS Speakers Corner > Movers of the Green Factory in Industry 4.0 – AGVs, Mobile Robots and Wireless Energy Transfer

Does Electronics Manufacturing need Mobile Robots and AGVs?

14:00-14:25 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: T. Mückl (Zollner Elektronik AG)

Tech Slam / Halle B2 / Talent Stage

14:00-15:00 Uhr | Halle B2 Talent Stage, B2, booth 470

Sprecher: Jaromir Konecny, Markus Berg, Martin Werz

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM

Keynote: Predictive Healthcare

14:00-14:30 Uhr | ICM - Internationales Congress Center München

Sprecher: Markus Bönig (Vitabook)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > MedTech Startup Challenge

Smart Investments in Health

14:05-14:20 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Tom Vanhoutte (imec.xpand)

Vortrag / Halle B2 / Innovation Forum > Printed Electronics Insights: Future of Mobility

Novel Anisotropic Conductive Films and Application Examples

14:20-14:40 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Morten Lindberget (CondAlign)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > MedTech Startup Challenge

Sensome: Medical Devices Enhanced by Microelectronics to Revolutionize the Treatment of Stroke

14:20-14:35 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Franz Bozsak (Sensome)

Vortrag / Halle B2 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Manufacturing II (hardware-centric)

14:25-14:30 Uhr | Halle B2 Tech Arena 2, Booth B1.770

Vortrag / Halle A1 / productronica Forum

Material Management 4.0

14:30-15:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Radu Diaconuescu (Swissmic SA)

Vortrag / PCB & EMS Speakers Corner > Movers of the Green Factory in Industry 4.0 – AGVs, Mobile Robots and Wireless Energy Transfer

Freedom for Robots & AGVs - Wireless Charging for Smarter Processes

14:30-14:50 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: M. Ebert (Wiferion)

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > 3D Printing

From Products to Prostates: Experiments in 3D Printing Design and Creative Arts

14:30-14:50 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Design | Designing Electronic Systems for Advanced Applications

14:30-14:40 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Workshop / Halle B3

Verpackungssysteme im ESD-Schutz und ihre Anwendungsbereiche

14:30-15:00 Uhr | Halle B3 Stand 172, Stat-X ESD-Komptenzzentrum

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > MedTech Startup Challenge

How Hyperspectral Sensing Technologies can Help Enabling Wearables for Health Diagnostics

14:35-14:50 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Dr. Carl Smets (Spectricity)

Vortrag / PCB & EMS Speakers Corner > Movers of the Green Factory in Industry 4.0 – AGVs, Mobile Robots and Wireless Energy Transfer

The HERO is a Robot - Transport and Handling with Robots in IC Production

14:40-14:55 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: M. Däumler (Fabmatics GmbH)

Vortrag / Halle B2 / Innovation Forum > Printed Electronics Insights: Future of Mobility

Printed Electronic Solutions for Future Automotive Mobility

14:40-15:00 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Michael Olk (IEE S.A.)

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Design | Designing Electronic Systems for Advanced Applications

Next Generation SoC Design: From Atoms to Systems

14:40-15:00 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > 3D Printing

The implementation of Additive Manufacturing

14:50-15:10 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Sprecher: Mark Harnett (Irish Manufacturing Research)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > MedTech Startup Challenge

Introducing the Next Generation of Sleep Diagnostics

14:50-15:05 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Soukaina Adnane (Onera)

Vortrag / PCB & EMS Speakers Corner > Movers of the Green Factory in Industry 4.0 – AGVs, Mobile Robots and Wireless Energy Transfer

Holding out for a HERO - How mobile robots master the challenges of IC factories

14:55-15:15 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Vortrag / Halle A1 / productronica Forum

Good Practices, to be "Best in Class" in SMT

15:00-15:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Ivan Román González (Continental Powertrain)

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM > Lower the Risks

Intuitive Orchestration of Context-Sensitive Surgical Assistance Systems

15:00-15:30 Uhr | ICM - Internationales Congress Center München

Sprecher: Lukas Bernhard (Klinikum rechts der Isar)

Vortrag / Smart Maintenance Pavillon / mfa

Discover Victoria's Secret, with Eye Tracking!

15:00-16:00 Uhr | Smart Maintenance Pavillon, Halle B2 Standnr. 133

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM > Wearables

Wearables And AI in Healthcare: Opportunities And Threats

15:00-15:30 Uhr | ICM - Internationales Congress Center München

Sprecher: Christoph Kämmerer (Analog Devices GmbH)

Vortrag / Halle B2 / Innovation Forum > Printed Electronics Insights: Future of Mobility

Illuminate the Touch: Inks for Advanced Printed Electronics

15:00-15:20 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Dr. Fabian Gyger (ELANTAS Europe GmbH)

Start-up Pitch / Halle B2 / Talent Stage

HACK THE FAIR - Pitches

15:00-16:00 Uhr | Halle B2 Talent Stage, B2, booth 470

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Design | Designing Electronic Systems for Advanced Applications

Near-Threshold Logic Benefits the Full Application Stack

15:00-15:20 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: Lauri Koskinen (Minima Processor)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > MedTech Startup Challenge

Enabling Smart MD with Custom Integrated Circuit (ASIC)

15:05-15:20 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Remy Girin (IC'Alps)

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > 3D Printing

3D electronic packaging for IoT devices – from prototype to series production

15:10-15:30 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Sprecher: Tobias Tiedje (TU Dresden IAVT, Faculty of Electrical and Computer Engineering, Electronics Packaging Laboratory)

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Design | Designing Electronic Systems for Advanced Applications

Deep Learning for Electronics Manufacturing

15:20-15:40 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Vortrag / Halle B2 / Innovation Forum > Printed Electronics Insights: Future of Mobility

Fabrication of glass laminated electronics – possibilities and challenges

15:20-15:40 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Tapio Fabritius (University of Oulu)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > MedTech Startup Challenge

A Medical Grade T-shirt for Continuous and Predictive Medical Remote Monitoring

15:20-15:35 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Laurent Vandebrouck (Chronolife)

Vortrag / PCB & EMS Speakers Corner > Movers of the Green Factory in Industry 4.0 – AGVs, Mobile Robots and Wireless Energy Transfer

Closing remarks

15:20-15:30 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Alexander Schmoldt (Chairman of Consortium "RFID Valuecreators")

Vortrag / Halle A1 / productronica Forum

Business Outlook: Global Electronics Industry (with emphasis on Europe)

15:30-16:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Walter Custer (Custer Consulting Group)

Session / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > 3D Printing

15:30-15:35 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM > Lower the Risks

500.000 Recalled Pacemakers, 2 Billion $ Stock Value Loss

15:30-16:00 Uhr | ICM - Internationales Congress Center München

Sprecher: Tobias Zillner (Alpha Strike Labs)

Vortrag / PCB & EMS Speakers Corner

Capabilities and performance of high reliability solder masks for the e-mobility and lighting field

15:30-16:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Sven Kramer (Lackwerke Peters)

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM > Wearables

Tools not Toys - Regulated Medical Devices Bundled with Phones

15:30-16:00 Uhr | ICM - Internationales Congress Center München

Sprecher: Prof. Dr. Chris Elliott (Leman Micro Device)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > MedTech Startup Challenge

K'Watch, World First Painless Continuous Glucose Monitoring Smartwatch

15:35-15:50 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Luc Pierart (PKvitality)

Vortrag / Halle B2 / Innovation Forum > Printed Electronics Insights: Future of Mobility

Customized Conductivity on Transparent Conductive Films

15:40-16:00 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Dr. Thomas Dietrich (Folex Coating GmbH)

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Design | Designing Electronic Systems for Advanced Applications

Cloud-Accelerated Innovation for Semiconductor Design and Verification

15:40-16:00 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Panel / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Global Trade Tensions: a zero-sum game for all ― is there a way out?

Global Trade Tensions: a zero-sum game for all ― is there a way out?

15:45-17:30 Uhr | Halle B1 Tech Arena 2, Booth B1.770

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > MedTech Startup Challenge

Non-Invasive Continuous Glucose Monitor (NICGM) for Diabetics

15:50-16:05 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: John Hubert (Alertgy)

Vortrag / Halle B2 / Innovation Forum

IT Innovation Management - A peek through the keyhole

16:00-16:30 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Max Typolt

Vortrag / PCB & EMS Speakers Corner

Cr(VI) free Silver passivations for Connectors - A comparison between organic and metallic passivations

16:00-16:30 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Dr. Bernd Roelfs

Vortrag / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Design | Designing Electronic Systems for Advanced Applications

Cloud Engineering Simulation: A Game Changer for Engineers

16:00-16:20 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Sprecher: Ian Campbell (OnScale)

Vortrag / Halle A1 / productronica Forum

Der kleinste Lasermarkierkopf der Welt setzt neue Standards bei der Produktkennzeichnung

16:00-16:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Sprecher: Frank Rehmus (FOBA Laser Marking + Engraving (ALLTEC GmbH))

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM > Wearables

Technology for Smart Medical Wearables Enables Better Health Monitoring

16:00-16:30 Uhr | ICM - Internationales Congress Center München

Sprecher: Andrew Baker (Maxim Integrated)

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM > Lower the Risks

Security Testing Medical Apps

16:00-16:30 Uhr | ICM - Internationales Congress Center München

Sprecher: Prof. Dr. Hartmut Pohl (softScheck), Wilfried Kirsch (softScheck)

Presentation / Halle B2 / SEMICON EUROPA > SMART MedTech > MedTech Startup Challenge

Closing by Session Chair

16:05-16:10 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Michael Kaiser (Smart Systems Hub GmbH)

Session / Halle B2 / SEMICON EUROPA > SMART MedTech > MedTech Startup Challenge

Technology Demo Zone & Networking

16:10-17:00 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Presentation / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Design | Designing Electronic Systems for Advanced Applications

Addressing the "New-Space" Paradigm Shift in Development and Production of High Reliability, Space Grade Semiconductor Components

16:20-16:40 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Vortrag / PCB & EMS Speakers Corner

The Advantages of Laser direct Imaging for Quick Turnaround PCB Production

16:30-17:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Raanan Novik

Award / Halle A1 / productronica Forum

IPC - Hand Soldering Competition - Price Ceremony

16:30-17:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Vortrag / Halle ICM - Internationales Congress Center München / eMEC - Medical Electronics Conference, 14. November 2019, Saal 2 und 3, ICM

Closing Panel Discussion: More Technology, Better Medicine?

16:30-17:00 Uhr | ICM - Internationales Congress Center München

Vortrag / Halle B2 / Innovation Forum

Elisa Smart Factory - Boosting Productivity with Industrial IoT and AI

16:30-17:00 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Kari Terho (Elisa Smart Factory)

Panel / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Design | Designing Electronic Systems for Advanced Applications

Panel discussion Executive Panel: A Jim Hogan Fireside Chat: The Risk of Obsolete Design and Verification Environments in the RISC-V Era

16:40-17:30 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Award / Halle B2 / Talent Stage

HACK THE FAIR - Preisverleihung

17:00-17:30 Uhr | Halle B2 Talent Stage, B2, booth 470

Networking / Halle B1 / SEMICON EUROPA > TechARENA 1 & 2 - Technological Platform for Innovation > Smart Design | Designing Electronic Systems for Advanced Applications

SEMI & ESDA Networking Hour

17:30-18:30 Uhr | Halle B1 Tech Arena 1, Booth B1.175

Party / Halle B2 / Talent Stage

17:30-22:00 Uhr | Halle B2 Talent Stage, B2, booth 470

Roundtable / Halle A1 / productronica Forum

Building a data-driven workforce

10:00-10:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Award / Halle B2 / Talent Stage

productronica Fast Forward - Announcement of the Finalists

10:00-10:15 Uhr | Halle B2 Talent Stage, B2, booth 470

Sprecher: Denise Bodrone (Elektor Verlag GmbH)

Vortrag / Halle B2 / SEMICON EUROPA > SEMI: Delivering Member Value

Contact Protocol & Welcome

10:00-10:10 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Laith Altimime (SEMI Europe)

Vortrag / Halle B2 / SEMICON EUROPA > SEMI: Delivering Member Value

2019/2020 Market Outlook: A Summary of Market Trends and Forecasts

10:10-10:30 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Lara Chamness (SEMI, Industry Research and Statistics)

Presentation / Halle B2 / Talent Stage

productronica Fast Forward - Presentation of the Sponsors

10:15-11:00 Uhr | Halle B2 Talent Stage, B2, booth 470

Workshop / Halle B3

Hochohm-Widerstandsmessungen und Ihre Aussagekraft

10:30-11:00 Uhr | Halle B3 Stand 172, Stat-X ESD-Komptenzzentrum

Vortrag / Halle B2 / Innovation Forum

Quantum Technology and IT Security

10:30-11:00 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Dr. Rachid El Bansarkhani (QuantiCor Security GmbH)

Vortrag / Halle B2 / SEMICON EUROPA > SEMI: Delivering Member Value

Pioneering Talent & Diversity Initiatives for Europe

10:30-10:50 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Cassandra Melvin (SEMI Europe)

Vortrag / PCB & EMS Speakers Corner

Automation and the intelligent use of production data in a smart PCB FAB

10:30-11:00 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Andreas Schatz (Atotech Deutschland GmbH)

Roundtable / Halle A1 / productronica Forum

Round Table: Soldering Automation - the challenges and the benefits

10:30-11:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Vortrag / Halle B2 / SEMICON EUROPA > SEMI: Delivering Member Value

Strategic Engagement through SEMI Technology Communities

10:50-11:05 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Roberto Dossi (Semi)

Start-up Pitch / Halle B2 / Talent Stage

productronica Fast Forward - Finale Pitches

11:00-11:30 Uhr | Halle B2 Talent Stage, B2, booth 470

Roundtable / Halle A1 / productronica Forum

Panel Discussion: Closing the Skills Gap: Who will my colleagues be in future?

11:00-11:30 Uhr | Halle A1 productronica Forum, A1, booth 220

Vortrag / PCB & EMS Speakers Corner

Detection of the ionic contamination under low standoff components

11:00-11:30 Uhr | PCB & EMS Speakers Corner, B3, booth 360

Sprecher: Freddy Gilbert (ZESTRON Europe ...a Business Division of Dr. O.K. Wack Chemie GmbH)

Vortrag / Halle B2 / Innovation Forum

Multi-technology approach to verify edge roundness

11:00-11:30 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Markus Fabich

Vortrag / Halle B2 / SEMICON EUROPA > SEMI: Delivering Member Value

Five Ways to Collaborate with SEMI Marketing and Boost Your Industry Presence

11:05-11:20 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Serena Brischetto (SEMI Europe)

Vortrag / Halle B2 / SEMICON EUROPA > SEMI: Delivering Member Value

Navigating the New Member Directory

11:20-11:45 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Sprecher: Eric Thoe (SEMI)

Vortrag / Halle B2 / Innovation Forum

Elisa Smart Factory - Boosting Productivity with Industrial IoT and AI

11:30-12:00 Uhr | Halle B2 Innovation Forum, B2, booth 441

Sprecher: Reiner Pes (Elisa Smart Factory)

Workshop / Halle B2 / Talent Stage

Innovationsmanagement

11:30-13:00 Uhr | Halle B2 Talent Stage, B2, booth 470

Sprecher: Start A Factory

Roundtable / Halle A1 / productronica Forum

Panel Discussion: The T-word, The B-word, The A-word…. The impact of current affairs on our global industry

11:30-12:00 Uhr | Halle A1 productronica Forum, A1, booth 220

Vortrag / Halle B2 / SEMICON EUROPA > SEMI: Delivering Member Value

SEMI Networking Lunch

11:45-12:45 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Award / Halle B2 / Innovation Forum

Innovation Award Winners

12:00-13:30 Uhr | Halle B2 Innovation Forum, B2, booth 441

Vortrag / Halle B2 / SEMICON EUROPA > SEMI: Delivering Member Value

12:45-12:50 Uhr | Halle B2 Inspiration Hub, Booth B2.261

Award / Halle B2 / Talent Stage

productronica Fast Forward – Preisverleihung

13:00-14:00 Uhr | Halle B2 Talent Stage, B2, booth 470

Workshop / Halle B3

Einsatzmöglichkeiten des Begehtestsystems im ESD-Schutz

14:30-15:00 Uhr | Halle B3 Stand 172, Stat-X ESD-Komptenzzentrum