Product innovations:

Chomerics Europe
Advanced shielded cast window to provide crucial EMI protection  

Master Bond
Two component silicone combines outstanding flexibility and high temperature resistance 

GÖPEL electronic
New generation of inline onboard programmer 

Fraunhofer IWS
Performance boost for microchips 

Bergquist
High slump resistance form-in-place dispensable thermal material 

Infineon
Peter Bauer resigns as CEO of Infineon 

Fritsch
Universal stencil printer for SMD production 

GÖPEL electronic
New system for 3D solder paste inspection 

Schroff
CompactPCI Serial - New desktop systems and new backplanes 

Schroff
MicroTCA power supply module in three versions 

Bergquist
Phase-change thermal materials featuring high temperature, high conductivity 

EPLAN
Efficient planning of copper rails 

University of Leeds
Bacteria producing electronics 

Microtronic
Automatic and PC-controlled solderability tester 

Lapp Kabel
Faster development and better products - Involving customers strengthens innovation 

MatriX Technologies
Micro- and nano-computed tomography also for small series inspection 

USC
Liquid solar cells 

AMS Technologies und WEBRA Industri
New liquid and evaporation cooler plates for power semiconductors 

Mirtec - pb tec
New AOI and SPI systems 

Physik Instrumente
XYZ nano-positioning stage for 3D laser lithography system 

Schroff
AdvancedTCA systems with AC solutions 

Master Bond
Abrasion resistant, flexible adhesive is serviceable at cryogenic temperatures 

Pewatron
New oxygen module - low-cost and compact 

Brewer Science
Thin wafer handling systems for compound semiconductor device processing 

Schroff
Flexible small case for standardised and non-standardised PCBs 

Rainbow Technology
New method for manufacturing touch-screen displays 

SIPLACE
Maintenance maximum performance with minimal maintenance 

Fritsch
Put an end to the high costs of stencil printing 

ASSET InterTech
Board bring-up solution first to validate, test and debug designs using the Intel microarchitecture code named Haswell 

Fraunhofer-Institut für Lasertechnik ILT
Laser technology sets stage for the cost-effective production of lightweight components 

Chomerics Europe
Conductive elastomer selector guide 

MSC
MACH XO2 series programming - now available for more than 10.000 Lattice MACH XO2 per day 

Vötsch Industrietechnik
Explosion-proof heating and drying oven - the safe solution as per new 94/9/EC requirements 

GÖPEL electronic
New board merger for the first time supports a completely project oriented definition of the multi board target architecture 

Manncorp
PCB production line for high-mix, low-to-mid-volume automated assembly 

Vötsch Industrietechnik
Everything is clean - thermotechnical application in particle-free atmosphere 

Master Bond
Chemically resistant, optically clear adhesive cures upon exposure to UV light 

Viscom
3-D MID Inspection System with short cycle times and high inspection depths 

Vitronic
Safely identifying and verifying - GAMP-compliant Auto-ID for codes, writings, logos and graphics 

Keithley
High voltage system to characterize an even broader range of power semiconductor devices and materials 

Schroff
CompactPCI Serial systems - new desktop systems and new backplanes 

Finetech
Semi-automated machine platform can be configured to perform as hot gas rework station or assembly and bonding platform 

X-FAB
Industry’s first 0.18 micrometer platform with high temperature, high voltage and non-volatile memory capability 

Nordson EFD
Two new dispense valve controllers - to build products better, faster, more cost-effectively 

SÜSS MicroTec
New resist coat and develop platform 

Weiss Umwelttechnik
Temperature shock test chamber - the stress limit for products 

NEC
Ultra-thin organic radical battery  

PennEngineering
Tooling installs self-clinching nuts in single pierce/press operation 

Technische Universität Wien
3D-Printer with Nano-Precision 

Mentor Graphics Consulting
Calibre Flow boosts global foundries silicon yield 

Argonne National Laboratory
Diamond brightens the performance of electronic devices 

Harting
Elegant way to connect a circuit board 

Viscom AG
Torsten Pelzer heads Viscom sales 

Institut für Solarenergieforschung Hameln (ISFH)
Screen printed silicon solar cell with record value 

GÖPEL electronic
First evaluation kit for Embedded System Access 

Rittal
New rack all-rounder impresses through simplicity and efficiency 

ALIO Industries
New mini-tripods with linear motors for laser applications, optical industry and metrology laboratories 

Gemini Integrated Electronics
New dual station constant ESD monitor 

Lackwerke Peters
Newly designed website improved service and user-friendly features 

Luxtera - STMicroelectronics
Silicon photonics solutions enables high-volume 

congatec
Smart cooling pipes pave the way for unlimited performance growth for COM Express modules 

Master Bond
One part epoxy offers exceptionally high tensile strength 

SIPLACE
Multi-gripper kit odd shapes placed instantly 

LATI Industria Termoplastici
New thermally conductive and self-extinguishing UL 94 

Odenwälder Kunststoffwerke
"Bodycases" for the user to wear them comfortably - whether on his arm, on his chest or round his waist 

Manncorp
Split-vision rework station now automatically places BGAs, CSPs, QFNs & PoPs 

Essemtec
New cobra feeder cart simplifies the set-up of SMD pick-and-place machines and facilitates feeder handling 

Nordson EFD
New high precision dispenser to increase productivity in you most critical dispensing applications 

SIPLACE
Successful cooperation - communication between man and machine matters most 

Binder
Samples perfectly protected - further improves ultra low temperature freezers 

Brewer Science
Pushing the limits of patterning technology and process flexibility 

2E mechatronic
New thermal membrane-based flow sensor 

Molex
New crimp terminals achieve the greatest durability and current per circuit available today 

Yamaichi Electronics
Resistance welding - new technology for the lowest possible contact resistance 

Rainbow Technology Systems
Board production - faster, easier and more profitable 

ViscoTec Pumpen- u. Dosiertechnik
New dosing system controls the dispensed bead 

NanoFocus
Laboratory System - fast 3D microscopy for industrial research 

SÜSS MicroTec
New platform for permanent wafer bonding, debonding and cleaning 

TRESKY
An experienced manufacturer breaks the mould of pick & place: first automatic die bonder 

SIPLACE
Line monitor - solid information makes for efficient production 

WEVO-Chemie
Polyurethane casting compounds with high thermal conductivity 

Vötsch Industrietechnik
Universal dryer - compact, safe and high performance 

ViscoTec Pumpen- u. Dosiertechnik
Micro dispensing in perfection 

Essemtec
Placing force measurement for pick-and-place machine 

ADLINK Technology
New vision system supporting IEEE 1588 (PTP) for multi-camera synchronization 

Vötsch Industrietechnik
Vacuum drying - product-friendly and fast 

Ecole Polytechnique Fédérale de Lausanne
Jumpstarting computers with 3D chips 

Festo
AirRay and the Bionic Handling Assistant - from beating wing drive to adaptive gripper 

Weiss Umwelttechnik
Reproducible qualification tests in fast motion - solar and photovoltaic units in endurance testing 

Verotec
Versatile subrack family for all applications 

SCHOTT Solar
SCHOTT Solar appoints Jörg Henkel Chief Sales & Marketing Officer 

Fraunhofer ISE / Bystronic glass
Great innovative leap in module production 

Master Bond
New electrically conductive, silver filled adhesive/sealant is USP Class VI approved 

ZMDI
Technological key innovation in the design of electronic systems 

Nordson EFD
Complete dispensing solutions with automated systems 

Essemtec
Professional printing in a tabletop format 

PennEngineering
Floating captive panel screws attach quickly and promote design flexibility 

GÖPEL electronic
Test bench generation for multi-chip modules and 3D chips 

Electrolube
New surface mount adhesives 

Mydata
Electronics assembly - faster, smarter and more agile 

Fritsch
A second that is worth it 

Weiss Umwelttechnik
First climate test chamber with integrated measuring robotic system 

Fritsch
Small helper for daily work 

Vötsch Industrietechnik
Heating and drying ovens with new control generation and higher nominal temperature 

Essemtec
Programmable precision printer - compact, precise and easy to use 

Omron - ATEcare
New AOI - world Novelty at productronica 

Tresky
High force bonder with a bonding force from 15 g up to 50 kg 

Essemtec
Affordable digital X-ray for every production 

WEVO-CHEMIE
Polyurethane casting compounds with high thermal conductivity 

Schroff
System series now complete - new 4 U MicroTCA.0 system 

Essemtec
Micro structures with nano pastes - new screen printing process prints fine structures with high cross sections 

Trumpf
Laser as a Key Technology - the photovoltaics industry benefits from laser technology 

Essemtec
New machine enables efficient 3D-MID production 

Trumpf
Most powerful industry-standard picosecond lasers in infrared and green 

Laboratory of Nanoscale Electronics and Structures
The first molybdenite microchip 

SÜSS MicroTec
Temporary bonder for 200mm and 300mm high-volume production 

Leica Microsystems
See more, understand faster - high-throughput inspection systems 

Weiss Umwelttechnik
With high speed to maximum product quality - test chambers with high temperature change rates 

Festo
A spatial miracle - microslide only 8 mm wide 

Nordson EFD
Dispensing systems for most challenging applications 

Electrolube
Silicone resin - specifically to meet the needs of the LED industry 

Northwestern University
Dramatic improvement of lithium-ion batteries 

Analog Devices
Analog Devices appoints Gernot Faigel as European regional channel director 

MIT
First diode for light 

Schreiner ProTech
Die-cut metal foils for cost-effective electronic functionalities 

National Instruments
Products advance PXI for record and playback, high-channel-count data acquisition, RF test and control 

Juki Automation Systems
JUKI Europe reports their best productronica fair since the foundation of the company 

MatriX Technologies
Xray inspection series for 3D analysis 

SIPLACE
productronica 2011 a great success - customer challenges have been mastered 

Weiss Umwelttechnik, A2.444
Corrosion testing complying with standards - corrosion test chamber for combined climate, temperature and salt spray tests 

Meta System Robotics - AEB Robotics, A4.317
Brand new automatic selective soldering station 

Ersa
Outstanding technology in a small system - the perfect start-up solution for efficient and reproducible selective soldering 

ruhlamat, B2.121
US wire embedding - complicated structures laid accurately and fast 

Cencorp, A3.347
NEW PCB depaneling cell brings higher productivity, flexibility and efficiency to the manufacturing process 

OK International, A4.127
Modular rework system now featuring a free-standing board holder 

DILAS Industrial Laser Systems, B2.136
New homogenized conduction-cooled, line-source at 600W, 880nm 

Gore, A1.459
Rugged assembly to reduce cost of high throughput RF test applications 

OK International, A4.127
An array of innovative products 

BMC Messsysteme, A1.266
Measurement technology via network at productronica 2011 

Mirtec, A2.377
Comprehensive range of AOI and SPI systems during productronica 2011 

Teknek, A2.429
Contact cleaning - a priority at productronica 

Data I/O, A2.205
New inline programming system 

InfraTec, A1.535
Infrared camera with extended range of functions 

Nordson DAGE, A2.339
Latest inspection technologies at productronica - bond testing and X-ray inspection systems to be on display 

GÖPEL electronic, A1.239
Goepel accelerates LAN based high-speed programming of massive flash images 

Omron - ATEcare, A1.141
AOI machine with a brand new concept of 3D inspection 

Thin Film Electronics ASA / PARC
First scalable printed CMOS memory  

DILAS Industrial Laser Systems, B2.136
Diode laser system series with extended beam quality 

Balver Zinn/ Cobar, A4.570
Complete SELective Soldering Package at Productronica 2011 

Arrow
Eric Schuck named president of Arrow EMEA Components 

Glenbrook Technologies, A3.455
New microfocus real time X-ray inspection system 

Northwestern University
A computer that rewires itself 

Leibniz INM
Gold surfaces repair themselves 

UC Santa Barbara
New method of growing high-quality graphene 

Binder, A2.161
Ideal interior volume - ultra low temperature freezers efficiently equipped 

Siemens aG
Ceramic printed circuit boards 

ASTER Technologies, A1.232
"Design-to-Test" feature for DfT and test coverage analysis tools 

ruhlamat, B2.121
US wire embedding - complicated structures laid accurately and fast 

JTAG Technologies, A1.458
Amazing JTAG/boundary-scan tool for debug & repair 

DuPont de Nemours, B1.155
New laminate delivers capability for flexible, high speed and high frequency design 

University of Manchester
"Big Mac" creates next generation of chips 

SIPLACE
Jeff Timms is the new SIPLACE Head for Cluster Americas 

ERBO, B1.420
Energy savings of approx. 30% for drill dust extraction systems in circuit board manufacturing 

LPKF Laser & Electronics, B2.105
Laser systems - three world firsts at the productronica 2011 trade fair 

Ingrid West Machinery, B3.367
Economic production tool for air coils using thermo-plastic coated wire 

Seica, A1.445
New innovative in-circuit and functional line tester with automatic loader 

OK International, A4.127
Powerful new desoldering system & unique upgrade option 

Purdue University
New "FeTRAM" is promising computer memory technology 

Fraunhofer IOSB
A living factory 

ASM Assembly Systems, A3.377
SIPLACE team well-positioned for the future of electronics production 

Tagarno, A2.129
Innovative HD digital system with 320x magnification 

Essemtec, A3.358
Intelligent concepts for SMD Production reduce manufacturing costs 

ADLINK Technology, A1.339
Multi-function USB DAQ modules - convenient and accurate USB-powered data acquisition 

Adllink Technology, A1.339
Feature-rich 3U CompactPCI PlusIO compatible blade with IPMI and TPM support 

Fraunhofer IPA
Professor Thomas Bauernhansl will lead Fraunhofer IPA  

Omron AOI Business Europe, A1.141
Analysis with process improvement tool 

GÖPEL electronic, A1.239
New graphical user interface for JTAG/Boundary Scan software platform 

Pickering Interfaces, A1.433
New range of 6GHz PXI solutions 

TU Chemnitz
Printed solar cells on paper 

LPKF
Volker Kühnle is taking over the management of LPKF China 

ETH Zürich
New high-power transistors made of gallium nitride 

Essemtec, A3.358
"Only solder solders, the rest suffer" 

Osram
Mini LEDs for super-flat touchscreens 

Aegis, A3.400
Industry’s first iPhone / iPad app for manufacturing operations at productronica 

Corelis Europe, Bayer DSP Systeme, A1.142
First test tool to include JTAG embedded test support for AMD Family 10 processors 

Chroma A.T.E., A1.355
New solar array simulation power supply provides dynamic MPPT test of PV inverter 

JTAG Technologies, A1.458
New JTAG/boundary-scan hardware interface product compatible to MAC-Panel SCOUT 

Elnec, A2.120
Industrial versions of programmers for 3rd party automated machines 

ASM Assembly Systems - Siplace, A3.377
Exciting presentation concept for Productronica 2011 

Lükon Thermal Solutions, A3.176
Reduction of the inline process time by integrated tests 

GÖPEL electronic, A1.239
Boundary scan platform extends integration of bus interface tests 

Agilent Technologies, A1.254
Audio analyzer with new digital audio interface options 

Pickering Electronics, A1.433
New two pole single-in-line relay 

Geotest, A1,269
New PXI-based test system for component, SoC and SiP test applications 

Heraeus, A3.361
Products compatible with all generations of solar cells 

Berkeley Lab
New X-Ray technique for electronic structures 

TE Connectivity, A4.101
New low-profile junction box for BIPV glass-glass crystalline solar modules features sealed one-component design 

Totech, A3.150
Oxidation free process alternative to MSD and PCB baking 

Essemtec, A3.258
SMT highly cersatile production on high quality level 

Globalfoundries
Dr. Rutger Wijburg is named vice president and general manager of "Fab 1" 

Stanford University
Faster organic semiconductors for flexible displays 

SCHOTT Solar
New record for monocrystalline screen-printed solar cells 

OK International, A4.127
Next generation of standalone desoldering equipment 

Data I/O, A2.205
New inline programming system 

Binder, A2.161
Ideal interior volume - ultra low temperature freezers efficiently equipped 

Smart Sonic, A2.312
100% closed-loop stencil cleaners 

SMT Detergent, A2,312
Manual stencil cleaning - safe & effective 

Juki Automation Systems, A3.143
Speed up the NPI process using new "Intelligent Shopfloor Solutions" 

Nordson, A2.339, A4.136, B1.149
Precision hot melt dispensing solution for PUR adhesive 

Rehm Thermal Systems, A4.341
Thermal oxidizer eliminates residue contamination from PV metallization process 

Agilent Technologies, A1.254
New measurement solution for optical transmitter 

Fraunhofer-Gesellschaft, B2.135
RELY Research Project - new ways of chip design methodology 

Interflux Electronics, A4.541
The absolutely halogen free tip tinner 

Rehm Thermal Systems, A4.341
Thermal Systems help customers address energy challenges 

Essemtec, A3.358
Automatic dispensing system doubles dispensing speed and accuracy 

Rehm Thermal Systems, A4.341
Fast firing furnaces continue to improve reduced cost of ownership for solar cell metallization 

FLIR Systems, A1.254
Macro lenses enable close-up thermal inspection 

JBC, A4.444
Tools for soldering and rework operations 

Glenbrook Technologies, A3.455
Real time X-ray inspection system to inspect BGA’s, pc boards, wire bonds and to check for counterfeit electronic components 

Lackwerke Peters, A2.430
Plugging paste was awarded the best flame class UL 94 V-0 at Underwriters Laboratories 

Baumüller
New General Manager for Baumüller China  

Instrument Systems, A1.144
Angle-resolved analysis - compact goniophotometer for packaged LEDs and small LED modules 

OK International, A4.127
Next generation of standalone desoldering equipment 

ASM Assembly Systems, A3.480
Zero-defect production of safety-critical applications with 3D coplanarity module 

Pickering Electronics, A1.433
New reed relays occupies small board area 

Physik Instrumente (PI), B2.151
Piezo crystalline phase shifter - precision without position sensor 

Georgia Institute of Technology
Ferroelectric nanostructures directly on plastic 

Universities of Göttingen, Bielefeld and Giessen / Massachusetts Institute of Technology (MIT)
Channelling waste heat in microprocessors in new directions 

Fraunhofer ISE
Compact charger with 97% efficiency for electric vehicles 

SEMI
Doug Neugold named SEMI chairman 

DiIT AG, B3.420
The most comprehensive MES system for the cutting area 

Toyohashi University
New multi-walled carbon nanocoils for battery technologie and NEMS 

American Chemical Society
An advance toward ultra-portable electronic devices 

ASTER Technologies, A1.232
Unique integrated DfT workflow from design to production 

Agilent Technologies, A1.254
First capacitance calibration standard for an atomic force microscope 

Physik Instrumente
Piezo motor enables lower profile rotation table with high resolution 

IMA Automation Berlin
Fully automatic backside contacting for thinfilm photovoltaics 

SUSS MicroTec
New system for automated handling, storage and inspection of EUVL reticles expanding the mask integrity infrastructure 

Fraunhofer IFF
Robotics: Safety without Protective Barriers 

Meister Strömungstechnik
Compact and for high pressures - flow monitor with flow indicator 

Chomerics Europe
Shielded windows support EMI compliance in growing number of products with high graphical content 

Schroff
Ruggedised MIL-STD-901D cabinet protects sensitive electronics in naval applications 

Heraeus Noblelight
Performance increase due to special micro-optics 

Sensirion
Liquid flow sensor for low-volume dosing applications 

PVA TePla
New Crystal-growing system on a laboratory scale 

Schreiner ProSecure - ProAuthent
Protection system for fully automatic recognition of original parts 

Schroff
New AdvancedMC modules feature low-profile push-pull handle 

Rittal
Ready-to-use, secure and energy-efficient 

TU München (TUM)
Sensitive skin for robots 

Physik Instrumente
SR microscope stages are more stable with capacitive feedback 

SME F. W. Taylor Research-Medal
"SME F. W. Taylor Research-Medal" for Professor Ekkard Brinksmeier 

Toshiba Corporation
New technology cuts phase noise in oscillation ICs for wireless communication 

American Institute of Physics
Graphene may gain an “on-off switch” 

Miami College of Engineering
New smaller, flexible LEDs 

Institute of Nanotechnology (KIT)
Self-assembling Electronic Nano-components  

IBM Labs
Researchers unveil nanotechnology circuits for wireless devices 

Würth Elektronik
First PCB producer in Germany receives seal of approval AEO F 

Samsung Electronics
Company adds 28nm LPH process technology to foundry roadmap 

Schreiner ProTech
New RFID solution for solar modules 

Rittal
Planning software makes verification as per IEC 61439 easy 

NIST
'Nanowire' measurements could improve computer memory 

TRaC
Test and certification specialist extends environmental test offering with new wide-range shaker 

Master Bond
Low viscosity, room temperature curing epoxy complies with FDA and USP Class VI requirements 

Binder
Safe drying – gently and quickly 

MAZeT
Microfluidic measuring station measures the smallest differences in color and transmission changes 

Imec - Cadence
Automated solution for testing 3D stacked ICs 

Imec
Imec processes first power devices on 200mm CMOS-compatible GaN-on-Si 

SIPLACE
Precedence finder - reliability from the first board on 

Essemtec
New tower with 70 percent more space for 13" reels 

Semikron
Goodbye to bond wires - new packaging technology replaces wire bonding 

Sensirion
Micro flow switch and bubble detector for liquids 

Essemtec
High-resolution solder paste inspection for printing and dispensing processes 

IMS
New passive thermal management devices in response to customer demand 

Molex
Solderless LED array holder eliminates the need for hand or SMT soldering, reducing installation time and costs 

PI Ceramic - Physik Instrumente (PI)
Lead-free piezo material enters series production 

Chomerics Europe
Conductive coatings of plastic enclosures combine high shielding performance and ease of application 

Ipetronik
Compact test bench for vehicle AC compressors 

HellermannTyton
Enclosing and protecting with PEC heat shrinkable end caps 

Manncorp
Solder paste website - fast & easy to use 

Fraunhofer-Institut für Produktionstechnik und Automatisierung
Controlling robotic arms is child’s play 

Odenwälder Kunststoffwerke Gehäusesysteme
Wall mounted cases with or without case cover 

Essemtec
Pick-and-Place machine combines high flexibility with the fast placement speed of an 8-axes placer 

Binder
Constant climate chambers with Light Quantum Control and ICH-complaint illumination 

Pioneer of Nanotechnology Award
Alexander Baladin will receive the Pioneer of Nanotechnology Award 

University of Cambridge
The next generation of ultra-small electronic devices 

Essemtec
An LED Processing System Must Be Accurate and Flexible 

U.S. Department of Energy’s (DOE)
Superconducting transistors for power-saving electronics 

Fraunhofer IMS
Crash sensor boosts safety in warehouses 

ASMPT
Four months after the SIPLACE acquisition - ASM Group sees its strategy confirmed 

Essemtec
Quick-to-install vacuum table and new inline system for SMD placement 

PolyIC
New highly conductive transparent, high-resolution structures on film 

Mikron Gruppe
Bruno Cathomen appointed CEO of Mikron Group 

GÖPEL electronic
High-performance 3D void inspection with inline X-Ray system 

Essemtec
Double-8-mm feeder increases placement rates by 25 percent 

SIPLACE
New user interface features fault analysis, self-healing routines and video assistant 

LPKF
3D prototyping solution 

GÖPEL electronic
Automated inspection of bonding pads 

IPTE
Completely fit for the build-up of a new mobile future - test equipment for sub-assemblies of upcoming electric vehicle 

Micronic Mydata AB
New, faster pick-and-place machine series 

Schroff
Pre-release information on MicroTCA.4 - new micro website 

Linn High Therm
Induction heated crucible furnace with vacuum and protective gas 

Advanced Interconnections Corporation
Unique solder preform terminals aid intrusive reflow 

Corelis
New version of boundary-scan tool suite features IEEE-1149.6 test development automation, expanded scripting 

Schroff
High-speed backplanes - data transfer up to 40 Gb/s 

GÖPEL electronic
Boundary scan platform extended by scalable multifunctional controllers 

Essemtec
Using automatic and semiautomatic pick-and-place systems in parallel proves a successful strategy 

Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme
Crash sensor boosts safety in warehouses 

Keithley
New instrument optimized for high power semiconductor test 

Manncorp
New LED-enabled pick and place system assembles 4 ft. long LED light panels 

Harting
Patch panel – flexible, space-saving and future-proof 

Master Bond
Optically clear, highly flexible epoxy cures at room temperature and withstands cryogenic conditions 

Binder
Electronics in endurance test - testing of PCBs and assemblies in a environmental simulation chamber 

Rittal
Economical and energy efficient cooling with outdoor air 

Bergquist Company
Advanced thermal interface tackles tougher challenges 

SIPLACE
Innovative setup concepts make electronics manufacturing more productive 

FutureCarbon
Electrically heated coating for temperatures up to 500°C 

Fraunhofer-Institut für Betriebsfestigkeit und Systemzuverlässigkeit
Quiet area for sensitive devices 

Binder
The perfect freezer - please tap to open 

SIPLACE
New placement equipment gives Hadler GmbH more production flexibility 

Ascentech - GEN3 Systems
New nano-coat, cleanliness test solutions 

GÖPEL electronic
GOEPEL electronic extends BSDL Testbench to multi chip modules and 3D chips 

SCHMIDT Technology
Flow sensors guarantee exact monitoring of the flow velocities 

Physik Instrumente
Precise and stable microscopy stages with direct drive 

Chomerics Europe
New form-in-place EMI gasket material simplifies assembly and reduces total cost of ownership 

Master Bond
Chemically resistant epoxy withstands a year in sulfuric & hydrochloric acid 

University of Rome Sapienza
New high-performance lithium-ion battery "top candidate" for electric cars 

Partnerschaft
GOEPEL electronic and xyco technologies force development of new test strategies for x86 architecture 

Fachhochschule St. Pölten
Silicon chip "replaces" rare earths 

University of New South Wales
Plastics get electric 

Schreiner ProSecure
Reliable authentication - new covert security feature for proof of authenticity 

Rittal
New enclosure heaters - no chance of condensation 

adaptronic Prüftechnik
Work safety and economy at the high voltage test of electrical distribution systems 

STATS ChipPAC
Enhanced flip chip packaging delivers low cost solution with superior reliability for advanced silicon nodes 

Manncorp
Split-version rework station hat auto removal / placement head for BGAs and QFPs 

Physik Instrumente
Six-axis motion in cacuums up to 10-6 hPa 

Physik-Instrumente
Fast piezo focusing systems: digital and more affordable 

EPLAN Software & Service
Mechatronic workflow simplifies and speeds up the entire engineering process 

Rittal
Climate control software with recooling configurator 

Master Bond
Silver conductive epoxy meets NASA low outgassing standards 

Essemtec
Tower automatic storage system increases the flexibility of production 

Fraunhofer IMS
UV-transparent coating for image sensors 

JNJ Industries
ESD roll creates instant ‘Blanket of Static Protection’ where needed 

Fraunhofer-Institut für Sichere Informationstechnologie
Fingerprint makes chips counterfeit-proof 

Chomerics Europe
Conductive coatings for shielding plastic medical equipment enclosures 

Jenoptik
Advanced level of microoptics system integration for semiconductor and FPD-equipment manufacturers 

Linn High Therm
New tube furnace with eight individual heating zones 

ASM Assembly Systems
New placement standards for unusual board sizes up to 910 mm 

Fischer Elektronik
Tube cases with integral guide slots for the accommodation of non-standard PCBs 

Toshiba Electronics Europe
Access to mature technologies and long-life process support for European ASIC customers 

Keithley Instruments
Parametric test systems for the semiconductor industry with enhanced throughput and accuracy 

Rittal
Power distribution system - rapid solutions for switchgear manufacturing 

Manncorp
New LED-capable pick-and-place systems 

Fraunhofer-Institut für Silicatforschung
Nanoworld in color 

Master Bond
High temperature resistant, toughened structural adhesive cures at room temperature 

JTAG Technologies
Eleven performance-boosting enhancements to boundary-scan tool 

Würth Elektronik
Unique adhesion soldering process enables flip chip bonding on the most varied of substrates 

Rittal
With just a few clicks to the right subrack 

Northwestern University
Breakthrough in converting heat waste to electricity 

Aviv University
Debunking solar energy efficiency measurements 

Binder
So cool, so safe - the safest ULT freezer (ultra low temperature) for the multi-user laboratory 

Rensselaer Polytechnic Institute
New Generation of Nano-Batteries  

Altair
Altair appoints general manager for europe 

Fraunhofer-Institut für Photonische Mikrosysteme IPMS
A shorter trip to microscanners with a construction kit 

Essemtec
Gaining Flexibility in SMT Production 

SIPLACE
Firm focus on LED placement market  

SCHMIDT Technology
Checking and managing air flows in the clean room 

Universitäten Twente, Utrecht und Nankai
Chip with its own solare cell 

National Institute for Materials Science
World’s first diamond nanoelectromechanical switch 

Kollmorgen
New vehicle controller delivers big performance in tight spaces and tough conditions 

Manncorp
Auto placer for prototyping/low volume assembly 

Molex
External thread DIN valve connectors with IP67 sealing performance and superior cable retention 

Master Bond
Thermally conductive epoxy delivers high temperature resistance & outstanding electrical insulation 

Schreiner ProTech
Reliable marking of leak-proof lines for automotive air conditioning systems 

GPD Global
Positive cavity displacement dispensing improves throughput and lowers cycle times 

GÖPEL electronic
New boundary scan relays card for integration into ICT adapter systems 

GMC-I PROSyS
AC/DC current probes offer simple clamp operation and measurement down to 1mA 

GPD Global
Positive Cavity Displacement technology is proven compatible with silver-filled electrical and thermal epoxies 

Essemtec
New drive system speeds printing 

Vötsch Industrietechnik
As fast as lightning - technical optimization with temperature shock tests 

Weiss Umwelttechnik
Most severe test for the solar technology - climate and temperature test for solar and photovoltaic units 

Manncorp
Dual-head pick-and-place features ball screw X-Y and 30 µm, 3 Sigma accuracy 

Schroff
New VPX clamshells remove heat and protect PCBs in defence applications 

Laser Zentrum Hannover e.V. (LZH)
Optimized production of solar absorbers 

Schroff
Impressive design and high functionality - New cabinet platform with 19" aluminium frame 

Viscom
With closed X-ray tube to maintenance-free X-ray inspection 

Viscom
AXI-OnDemand – fast and reliable defect detection with fewer false alarms 

LPKF - LaserMicronics
Spray coating method for laser direct structuring (LDS) 

Semiconductor Industry Association (SIA)
Chairman of Analog Devices elected SIA Chairman 

Physik Instrumente
Piezo-based linear drive for automation technology - self-locking and non-magnetic 

Toshiba Electronics Europe
130nm BiCD for next-generation automotive-rugged integration 

Chomerics Europe
EMI shielding gasket provides ideal solution for medical equipment enclosure applications 

IBM
New Chip Technology dramatically increases the memory capacity and processing speeds  

American Institute of Physics
"Chaogates" hold promise for the semiconductor industry 

SIPLACE
Placement machines for sensor manufacturing specialist 

Seika Machinery
Quick adjustment times for magazine racks 

SÜSS MicroTec / Fraunhofer IST
New technology for selective surface treatment 

Weiss Umwelttechnik
Robot operation in all climatic zones 

Vötsch Industrietechnik
The key to success - temperature and climatic test chambers 

DEK
Breakthrough new ‘fluxophobic’ stencil coating technology 

Binder
Complete program - environmental simulation chambers from 53 – 720 l 

Hofmann Leiterplatten
PCBs in AML Technology also work as cases 

Fraunhofer-Institut für Lasertechnik (ILT)
Conductor paths for marvelous light 

Reinhausen Plasma
Metallize and coat more easily, more cost-effectively and with less environmental impact 

Schmidt Technology
Minimum expense for maximum saving - flow sensors specifically for compressed air applications 

Coherent
New direct diode system for OLED FRIT welding, plastic welding and soldering 

FCT Assembly
New no-clean leaded halogen-free solder paste 

Xilinx
Stacked Silicon Interconnect extends FPGA technology to deliver “more than moore” density, bandwidth and power efficiency 

Rittal
Air cooling in the machine room 

Rensselaer Polytechnic Institute
Water could hold answer to graphene nanoelectronics  

National Institute for Nanotechnology (NINT)
Microwave oven key to self-assembly process meeting semi-conductor industry need 

DuPont
New films for flexible and thin film photovoltaic applications 

Wittmann Battenfeld
Optimal parts quality through online thermography  

Fraunhofer IST
Producing circuit boards with plasma 

ACE Production Technologies
New selective soldering programming software 

RFMD
GaAs technologies manufactured in europe 

VDMA
Dr. Thomas Lindner elected President of the VDMA 

EV Group
New rechnology achieves ultra-high-resolution patterning down to 12.5 nm 

JTAG Technologies - electronica A1.221
Full-featured value boundary-scan developers suite offers complete JTAG development package 

Original1 und Schreiner ProSecure
Tracking down fakes with intelligent systems 

Schroff
High demands made of cabinets in railway systems - shock resistance up to 5g 

Bliss Industries
SMT splicing cart demos now available 

BPM Microsystems
Industry’s fastest universal device programmer 

Acculogic
Double-sided, multi-probe flying probe system with 3-D probing, analog, digital and boundary scan test capability  

Keithley
Semiconductor parametric test software provides new levels of usability, convenience and productivity 

Essemtec
Flexible SMT pick-and-place machine simplifies complex tasks 

Lütze
Solar cable and connector range for photovoltaic applications 

Trumpf
New ceiling-mounted supply units enables individual configuration 

Acculogic
Reverse engineering software 

Schroff
One platform for countless possibilities - robust products for railway systems 

Sensor Products
Sensor system ensures optimal heat sink efficiency 

Northwestern University and the University of Illinois
New method to print electronics on complex surfaces 

Becquerel Prize
Prof. Dr. Hans-Werner Schock received the prestigious "Becquerel Prize 

Sensor Products
Solar conformal coating 

Coherent
New turn key laser-based process tools for c-Si cell manufacturing 

University of California, Berkeley
An artificial skin out of nanowires 

Essemtec
Highly flexible and fast SMD assembly machine 

Data I/O
Support for SOT-23 packages in automated handlers 

OKW Odenwälder Kunststoffwerke
Wall-mounted and desktop series - modern dialog 

Essemtec
Selective radiation soldering for flex-circuits 

Fraunhofer IST
Playing snooker with atoms 

Newport
Integrated overhead shelf for optical tables 

Juki
New modular placement systems 

Oerlikon Solar
Two world records - lowest module production cost and highest lab cell efficiency 

Master Bond
Room temperature curing, flexibilized epoxy combines high strength and toughness with chemical and abrasion resistance 

Keithley Instruments
New switch mainframes boost system throughput for semiconductor test applications 

State-of-the-art manufacturing
Computrol’s capabilities provide customers with cost-efficient contract manufacturing 

Mill-Max
New receptacles with organic fibre plug solder barrier 

Manncorp
New line of rework systems 

Jenoptik-Sparte Laser & Materialbearbeitung
New laser systems for crystalline photovoltaic 

SUSS MicroTec
SUSS MicroTec appoints Dr Rainer Knippelmeyer as Vice President R&D 

CyberOptics
Industry’s first ever modular AOI solution for populated printed circuit 

Schroff
New 19in. chassis features all-aluminium design 

DOE's Oak Ridge National Laboratory
Solving Graphene Mystery 

Rittal
Low-voltage switchgear - every version from one construction kit 

VJ Technologies
New rework platform at Electronica/Productronica India 2010 

SIPLACE
Whispering-down-the-Line - more efficient forwarding of ink spot and barcode data raises the line output 

HEI
Engineering system for rigid, flex, and rigid flex boards  

Rittal
Hygienic Design series - terminal boxes now safer and cleaner 

Tyco Electronics
New high accuracy double sided printer for marker sleeve printing 

Rehm Thermal Systems
New series of solar equipment for metallization lines 

LIMO
Higher yield with diode lasers for fast in-line solar cell inspection 

Applied Materials
Advanced microchip designs with breakthrough flowable CVD technology  

Harvard University
New nanoscale transistors allow sensitive probing inside cells 

Master Bond
Thermally conductive, low viscosity epoxy features cryogenic serviceability 

CyberOptics
World’s fastest AOI system and newest SPI system at Productronica India 2010 

Rittal
Software helps in assembly 

Vi TECHNOLOGY
Pin through hole inspection as a single test or part of a mixed mode SMT/THT process 

Vitronics Soltec
Enhanced reflow system offering improved performance in terms of ease of use 

Count On Tools
Complete line of Panasonic CM nozzles 

Fraunhofer-Institut für Lasertechnik ILT
Glass biochips for medical engineering - resource-friendly, cost-effective and high-quality 

Gen3 Systems
New and improved cleanliness testers 

Corelis
Low voltage JTAG adapter for Intel processors 

SIPLACE
Stable production processes thanks to fewer production interruptions and faster restarts of the line 

Atlantic Zeiser
Advanced printing innovations for the coding of packaging and labels 

Linn High Therm GmbH
Microwave chamber furnace for research and design 

Keithley
Free CD of nanotechnology test tutorials  

Bergquist
Superior dielectric lowers operating temperatures 

Gutenberg Research Award 2010
Professor Shoucheng Zhang of Stanford University receives the 2010 Gutenberg Research Award  

Purdue University
New system to cool "power electronics" 

University of Southern California
New breed of solar cells of transparent atom films 

Max-Planck-Instituts Polymerforschung
Nanoribbons for graphene transistors 

Siemens Electronics Assembly Systems
Waffle pack changer with non-stop module 

Christopher Associates
New solder paste printing process guide 

Master Bond
New chemically resistant electrically insulative structural adhesive with exceptional strength properties 

SEHO Systems
Innovative fluxer spray head to reduce flux consumption 

X-FAB
Industry’s first 100V high-voltage 0.35 micrometer foundry process 

Electronic Interconnect
DFM service catches PCB design problems up front 

Essemtec
Pick-and-place system dispenses solder paste of 100 µm diameters 

Physik Instrumente (PI)
Industrial robot turns into precise machining system 

Weber Ultrasonics
New 250 kHz ultrasonic generator allows careful and efficient cleaning of the most sensitive substrates 

Touchdown Technologies - Verigy
Industry’s lowest force probe card protects devices-under-test from potentially damaging stresses 

Siemens
System for point-of-use ultrapure water treatment systems for semiconductor applications 

Rohde & Schwarz
Change at the helm of Rohde & Schwarz: Manfred Fleischmann succeeds Michael Vohrer 

EV Group
New wafer bonder system for university and R&D customers at an affordable cost