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Up-to-date - 09.02.2012
Final report productronica 2011 - 34 per cent growth
High level of bookings for LOPE-C in Munich
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Industry News
Market-Center
Product innovations
Product innovations
ViscoTec Pumpen- u. Dosiertechnik
New dosing system controls the dispensed bead
A dosing system of preeflow form ViscoTec Pumpen- u. Dosiertechnik stands for user-friendly and intuitive usable dosing systems which offers you an accurate and precise dosage. With those attributes you can also achieve savings of medium up to 30 %.
Product innovations:
NanoFocus
Laboratory System - fast 3D microscopy for industrial research
SÜSS MicroTec
New platform for permanent wafer bonding, debonding and cleaning
TRESKY
An experienced manufacturer breaks the mould of pick & place: first automatic die bonder
SIPLACE
Line monitor - solid information makes for efficient production
WEVO-Chemie
Polyurethane casting compounds with high thermal conductivity
Vötsch Industrietechnik
Universal dryer - compact, safe and high performance
ViscoTec Pumpen- u. Dosiertechnik
Micro dispensing in perfection
Essemtec
Placing force measurement for pick-and-place machine
ADLINK Technology
New vision system supporting IEEE 1588 (PTP) for multi-camera synchronization
Vötsch Industrietechnik
Vacuum drying - product-friendly and fast
Ecole Polytechnique Fédérale de Lausanne
Jumpstarting computers with 3D chips
Festo
AirRay and the Bionic Handling Assistant - from beating wing drive to adaptive gripper
Weiss Umwelttechnik
Reproducible qualification tests in fast motion - solar and photovoltaic units in endurance testing
Verotec
Versatile subrack family for all applications
SCHOTT Solar
SCHOTT Solar appoints Jörg Henkel Chief Sales & Marketing Officer
Fraunhofer ISE / Bystronic glass
Great innovative leap in module production
Master Bond
New electrically conductive, silver filled adhesive/sealant is USP Class VI approved
ZMDI
Technological key innovation in the design of electronic systems
Nordson EFD
Complete dispensing solutions with automated systems
Essemtec
Professional printing in a tabletop format
PennEngineering
Floating captive panel screws attach quickly and promote design flexibility
GÖPEL electronic
Test bench generation for multi-chip modules and 3D chips
Electrolube
New surface mount adhesives
Mydata
Electronics assembly - faster, smarter and more agile
Fritsch
A second that is worth it
Weiss Umwelttechnik
First climate test chamber with integrated measuring robotic system
Fritsch
Small helper for daily work
Vötsch Industrietechnik
Heating and drying ovens with new control generation and higher nominal temperature
Essemtec
Programmable precision printer - compact, precise and easy to use
Omron - ATEcare
New AOI - world Novelty at productronica
Tresky
High force bonder with a bonding force from 15 g up to 50 kg
Essemtec
Affordable digital X-ray for every production
WEVO-CHEMIE
Polyurethane casting compounds with high thermal conductivity
Schroff
System series now complete - new 4 U MicroTCA.0 system
Essemtec
Micro structures with nano pastes - new screen printing process prints fine structures with high cross sections
Trumpf
Laser as a Key Technology - the photovoltaics industry benefits from laser technology
Essemtec
New machine enables efficient 3D-MID production
Trumpf
Most powerful industry-standard picosecond lasers in infrared and green
Laboratory of Nanoscale Electronics and Structures
The first molybdenite microchip
SÜSS MicroTec
Temporary bonder for 200mm and 300mm high-volume production
Leica Microsystems
See more, understand faster - high-throughput inspection systems
Weiss Umwelttechnik
With high speed to maximum product quality - test chambers with high temperature change rates
Festo
A spatial miracle - microslide only 8 mm wide
Nordson EFD
Dispensing systems for most challenging applications
Electrolube
Silicone resin - specifically to meet the needs of the LED industry
Northwestern University
Dramatic improvement of lithium-ion batteries
Analog Devices
Analog Devices appoints Gernot Faigel as European regional channel director
MIT
First diode for light
Schreiner ProTech
Die-cut metal foils for cost-effective electronic functionalities
National Instruments
Products advance PXI for record and playback, high-channel-count data acquisition, RF test and control
Juki Automation Systems
JUKI Europe reports their best productronica fair since the foundation of the company
MatriX Technologies
Xray inspection series for 3D analysis
SIPLACE
productronica 2011 a great success - customer challenges have been mastered
Weiss Umwelttechnik, A2.444
Corrosion testing complying with standards - corrosion test chamber for combined climate, temperature and salt spray tests
Meta System Robotics - AEB Robotics, A4.317
Brand new automatic selective soldering station
Ersa
Outstanding technology in a small system - the perfect start-up solution for efficient and reproducible selective soldering
ruhlamat, B2.121
US wire embedding - complicated structures laid accurately and fast
Cencorp, A3.347
NEW PCB depaneling cell brings higher productivity, flexibility and efficiency to the manufacturing process
OK International, A4.127
Modular rework system now featuring a free-standing board holder
DILAS Industrial Laser Systems, B2.136
New homogenized conduction-cooled, line-source at 600W, 880nm
Gore, A1.459
Rugged assembly to reduce cost of high throughput RF test applications
OK International, A4.127
An array of innovative products
BMC Messsysteme, A1.266
Measurement technology via network at productronica 2011
Mirtec, A2.377
Comprehensive range of AOI and SPI systems during productronica 2011
Teknek, A2.429
Contact cleaning - a priority at productronica
Data I/O, A2.205
New inline programming system
InfraTec, A1.535
Infrared camera with extended range of functions
Nordson DAGE, A2.339
Latest inspection technologies at productronica - bond testing and X-ray inspection systems to be on display
GÖPEL electronic, A1.239
Goepel accelerates LAN based high-speed programming of massive flash images
Omron - ATEcare, A1.141
AOI machine with a brand new concept of 3D inspection
Thin Film Electronics ASA / PARC
First scalable printed CMOS memory
DILAS Industrial Laser Systems, B2.136
Diode laser system series with extended beam quality
Balver Zinn/ Cobar, A4.570
Complete SELective Soldering Package at Productronica 2011
Arrow
Eric Schuck named president of Arrow EMEA Components
Glenbrook Technologies, A3.455
New microfocus real time X-ray inspection system
Northwestern University
A computer that rewires itself
Leibniz INM
Gold surfaces repair themselves
UC Santa Barbara
New method of growing high-quality graphene
Binder, A2.161
Ideal interior volume - ultra low temperature freezers efficiently equipped
Siemens aG
Ceramic printed circuit boards
ASTER Technologies, A1.232
"Design-to-Test" feature for DfT and test coverage analysis tools
ruhlamat, B2.121
US wire embedding - complicated structures laid accurately and fast
JTAG Technologies, A1.458
Amazing JTAG/boundary-scan tool for debug & repair
DuPont de Nemours, B1.155
New laminate delivers capability for flexible, high speed and high frequency design
University of Manchester
"Big Mac" creates next generation of chips
SIPLACE
Jeff Timms is the new SIPLACE Head for Cluster Americas
ERBO, B1.420
Energy savings of approx. 30% for drill dust extraction systems in circuit board manufacturing
LPKF Laser & Electronics, B2.105
Laser systems - three world firsts at the productronica 2011 trade fair
Ingrid West Machinery, B3.367
Economic production tool for air coils using thermo-plastic coated wire
Seica, A1.445
New innovative in-circuit and functional line tester with automatic loader
OK International, A4.127
Powerful new desoldering system & unique upgrade option
Purdue University
New "FeTRAM" is promising computer memory technology
Fraunhofer IOSB
A living factory
ASM Assembly Systems, A3.377
SIPLACE team well-positioned for the future of electronics production
Tagarno, A2.129
Innovative HD digital system with 320x magnification
Essemtec, A3.358
Intelligent concepts for SMD Production reduce manufacturing costs
ADLINK Technology, A1.339
Multi-function USB DAQ modules - convenient and accurate USB-powered data acquisition
Adllink Technology, A1.339
Feature-rich 3U CompactPCI PlusIO compatible blade with IPMI and TPM support
Fraunhofer IPA
Professor Thomas Bauernhansl will lead Fraunhofer IPA
Omron AOI Business Europe, A1.141
Analysis with process improvement tool
GÖPEL electronic, A1.239
New graphical user interface for JTAG/Boundary Scan software platform
Pickering Interfaces, A1.433
New range of 6GHz PXI solutions
TU Chemnitz
Printed solar cells on paper
LPKF
Volker Kühnle is taking over the management of LPKF China
ETH Zürich
New high-power transistors made of gallium nitride
Essemtec, A3.358
"Only solder solders, the rest suffer"
Osram
Mini LEDs for super-flat touchscreens
Aegis, A3.400
Industry’s first iPhone / iPad app for manufacturing operations at productronica
Corelis Europe, Bayer DSP Systeme, A1.142
First test tool to include JTAG embedded test support for AMD Family 10 processors
Chroma A.T.E., A1.355
New solar array simulation power supply provides dynamic MPPT test of PV inverter
JTAG Technologies, A1.458
New JTAG/boundary-scan hardware interface product compatible to MAC-Panel SCOUT
Elnec, A2.120
Industrial versions of programmers for 3rd party automated machines
ASM Assembly Systems - Siplace, A3.377
Exciting presentation concept for Productronica 2011
Lükon Thermal Solutions, A3.176
Reduction of the inline process time by integrated tests
GÖPEL electronic, A1.239
Boundary scan platform extends integration of bus interface tests
Agilent Technologies, A1.254
Audio analyzer with new digital audio interface options
Pickering Electronics, A1.433
New two pole single-in-line relay
Geotest, A1,269
New PXI-based test system for component, SoC and SiP test applications
Heraeus, A3.361
Products compatible with all generations of solar cells
Berkeley Lab
New X-Ray technique for electronic structures
TE Connectivity, A4.101
New low-profile junction box for BIPV glass-glass crystalline solar modules features sealed one-component design
Totech, A3.150
Oxidation free process alternative to MSD and PCB baking
Essemtec, A3.258
SMT highly cersatile production on high quality level
Globalfoundries
Dr. Rutger Wijburg is named vice president and general manager of "Fab 1"
Stanford University
Faster organic semiconductors for flexible displays
SCHOTT Solar
New record for monocrystalline screen-printed solar cells
OK International, A4.127
Next generation of standalone desoldering equipment
Data I/O, A2.205
New inline programming system
Binder, A2.161
Ideal interior volume - ultra low temperature freezers efficiently equipped
Smart Sonic, A2.312
100% closed-loop stencil cleaners
SMT Detergent, A2,312
Manual stencil cleaning - safe & effective
Juki Automation Systems, A3.143
Speed up the NPI process using new "Intelligent Shopfloor Solutions"
Nordson, A2.339, A4.136, B1.149
Precision hot melt dispensing solution for PUR adhesive
Rehm Thermal Systems, A4.341
Thermal oxidizer eliminates residue contamination from PV metallization process
Agilent Technologies, A1.254
New measurement solution for optical transmitter
Fraunhofer-Gesellschaft, B2.135
RELY Research Project - new ways of chip design methodology
Interflux Electronics, A4.541
The absolutely halogen free tip tinner
Rehm Thermal Systems, A4.341
Thermal Systems help customers address energy challenges
Essemtec, A3.358
Automatic dispensing system doubles dispensing speed and accuracy
Rehm Thermal Systems, A4.341
Fast firing furnaces continue to improve reduced cost of ownership for solar cell metallization
FLIR Systems, A1.254
Macro lenses enable close-up thermal inspection
JBC, A4.444
Tools for soldering and rework operations
Glenbrook Technologies, A3.455
Real time X-ray inspection system to inspect BGA’s, pc boards, wire bonds and to check for counterfeit electronic components
Lackwerke Peters, A2.430
Plugging paste was awarded the best flame class UL 94 V-0 at Underwriters Laboratories
Baumüller
New General Manager for Baumüller China
Instrument Systems, A1.144
Angle-resolved analysis - compact goniophotometer for packaged LEDs and small LED modules
OK International, A4.127
Next generation of standalone desoldering equipment
ASM Assembly Systems, A3.480
Zero-defect production of safety-critical applications with 3D coplanarity module
Pickering Electronics, A1.433
New reed relays occupies small board area
Physik Instrumente (PI), B2.151
Piezo crystalline phase shifter - precision without position sensor
Georgia Institute of Technology
Ferroelectric nanostructures directly on plastic
Universities of Göttingen, Bielefeld and Giessen / Massachusetts Institute of Technology (MIT)
Channelling waste heat in microprocessors in new directions
Fraunhofer ISE
Compact charger with 97% efficiency for electric vehicles
SEMI
Doug Neugold named SEMI chairman
DiIT AG, B3.420
The most comprehensive MES system for the cutting area
Toyohashi University
New multi-walled carbon nanocoils for battery technologie and NEMS
American Chemical Society
An advance toward ultra-portable electronic devices
ASTER Technologies, A1.232
Unique integrated DfT workflow from design to production
Agilent Technologies, A1.254
First capacitance calibration standard for an atomic force microscope
Physik Instrumente
Piezo motor enables lower profile rotation table with high resolution
IMA Automation Berlin
Fully automatic backside contacting for thinfilm photovoltaics
SUSS MicroTec
New system for automated handling, storage and inspection of EUVL reticles expanding the mask integrity infrastructure
Fraunhofer IFF
Robotics: Safety without Protective Barriers
Meister Strömungstechnik
Compact and for high pressures - flow monitor with flow indicator
Chomerics Europe
Shielded windows support EMI compliance in growing number of products with high graphical content
Schroff
Ruggedised MIL-STD-901D cabinet protects sensitive electronics in naval applications
Heraeus Noblelight
Performance increase due to special micro-optics
Sensirion
Liquid flow sensor for low-volume dosing applications
PVA TePla
New Crystal-growing system on a laboratory scale
Schreiner ProSecure - ProAuthent
Protection system for fully automatic recognition of original parts
Schroff
New AdvancedMC modules feature low-profile push-pull handle
Rittal
Ready-to-use, secure and energy-efficient
TU München (TUM)
Sensitive skin for robots
Physik Instrumente
SR microscope stages are more stable with capacitive feedback
SME F. W. Taylor Research-Medal
"SME F. W. Taylor Research-Medal" for Professor Ekkard Brinksmeier
Toshiba Corporation
New technology cuts phase noise in oscillation ICs for wireless communication
American Institute of Physics
Graphene may gain an “on-off switch”
Miami College of Engineering
New smaller, flexible LEDs
Institute of Nanotechnology (KIT)
Self-assembling Electronic Nano-components
IBM Labs
Researchers unveil nanotechnology circuits for wireless devices
Würth Elektronik
First PCB producer in Germany receives seal of approval AEO F
Samsung Electronics
Company adds 28nm LPH process technology to foundry roadmap
Schreiner ProTech
New RFID solution for solar modules
Rittal
Planning software makes verification as per IEC 61439 easy
NIST
'Nanowire' measurements could improve computer memory
TRaC
Test and certification specialist extends environmental test offering with new wide-range shaker
Master Bond
Low viscosity, room temperature curing epoxy complies with FDA and USP Class VI requirements
Binder
Safe drying – gently and quickly
MAZeT
Microfluidic measuring station measures the smallest differences in color and transmission changes
Imec - Cadence
Automated solution for testing 3D stacked ICs
Imec
Imec processes first power devices on 200mm CMOS-compatible GaN-on-Si
SIPLACE
Precedence finder - reliability from the first board on
Essemtec
New tower with 70 percent more space for 13" reels
Semikron
Goodbye to bond wires - new packaging technology replaces wire bonding
Sensirion
Micro flow switch and bubble detector for liquids
Essemtec
High-resolution solder paste inspection for printing and dispensing processes
IMS
New passive thermal management devices in response to customer demand
Molex
Solderless LED array holder eliminates the need for hand or SMT soldering, reducing installation time and costs
PI Ceramic - Physik Instrumente (PI)
Lead-free piezo material enters series production
Chomerics Europe
Conductive coatings of plastic enclosures combine high shielding performance and ease of application
Ipetronik
Compact test bench for vehicle AC compressors
HellermannTyton
Enclosing and protecting with PEC heat shrinkable end caps
Manncorp
Solder paste website - fast & easy to use
Fraunhofer-Institut für Produktionstechnik und Automatisierung
Controlling robotic arms is child’s play
Odenwälder Kunststoffwerke Gehäusesysteme
Wall mounted cases with or without case cover
Essemtec
Pick-and-Place machine combines high flexibility with the fast placement speed of an 8-axes placer
Binder
Constant climate chambers with Light Quantum Control and ICH-complaint illumination
Pioneer of Nanotechnology Award
Alexander Baladin will receive the Pioneer of Nanotechnology Award
University of Cambridge
The next generation of ultra-small electronic devices
Essemtec
An LED Processing System Must Be Accurate and Flexible
U.S. Department of Energy’s (DOE)
Superconducting transistors for power-saving electronics
Fraunhofer IMS
Crash sensor boosts safety in warehouses
ASMPT
Four months after the SIPLACE acquisition - ASM Group sees its strategy confirmed
Essemtec
Quick-to-install vacuum table and new inline system for SMD placement
PolyIC
New highly conductive transparent, high-resolution structures on film
Mikron Gruppe
Bruno Cathomen appointed CEO of Mikron Group
GÖPEL electronic
High-performance 3D void inspection with inline X-Ray system
Essemtec
Double-8-mm feeder increases placement rates by 25 percent
SIPLACE
New user interface features fault analysis, self-healing routines and video assistant
LPKF
3D prototyping solution
GÖPEL electronic
Automated inspection of bonding pads
IPTE
Completely fit for the build-up of a new mobile future - test equipment for sub-assemblies of upcoming electric vehicle
Micronic Mydata AB
New, faster pick-and-place machine series
Schroff
Pre-release information on MicroTCA.4 - new micro website
Linn High Therm
Induction heated crucible furnace with vacuum and protective gas
Advanced Interconnections Corporation
Unique solder preform terminals aid intrusive reflow
Corelis
New version of boundary-scan tool suite features IEEE-1149.6 test development automation, expanded scripting
Schroff
High-speed backplanes - data transfer up to 40 Gb/s
GÖPEL electronic
Boundary scan platform extended by scalable multifunctional controllers
Essemtec
Using automatic and semiautomatic pick-and-place systems in parallel proves a successful strategy
Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme
Crash sensor boosts safety in warehouses
Keithley
New instrument optimized for high power semiconductor test
Manncorp
New LED-enabled pick and place system assembles 4 ft. long LED light panels
Harting
Patch panel – flexible, space-saving and future-proof
Master Bond
Optically clear, highly flexible epoxy cures at room temperature and withstands cryogenic conditions
Binder
Electronics in endurance test - testing of PCBs and assemblies in a environmental simulation chamber
Rittal
Economical and energy efficient cooling with outdoor air
Bergquist Company
Advanced thermal interface tackles tougher challenges
SIPLACE
Innovative setup concepts make electronics manufacturing more productive
FutureCarbon
Electrically heated coating for temperatures up to 500°C
Fraunhofer-Institut für Betriebsfestigkeit und Systemzuverlässigkeit
Quiet area for sensitive devices
Binder
The perfect freezer - please tap to open
SIPLACE
New placement equipment gives Hadler GmbH more production flexibility
Ascentech - GEN3 Systems
New nano-coat, cleanliness test solutions
GÖPEL electronic
GOEPEL electronic extends BSDL Testbench to multi chip modules and 3D chips
SCHMIDT Technology
Flow sensors guarantee exact monitoring of the flow velocities
Physik Instrumente
Precise and stable microscopy stages with direct drive
Chomerics Europe
New form-in-place EMI gasket material simplifies assembly and reduces total cost of ownership
Master Bond
Chemically resistant epoxy withstands a year in sulfuric & hydrochloric acid
University of Rome Sapienza
New high-performance lithium-ion battery "top candidate" for electric cars
Partnerschaft
GOEPEL electronic and xyco technologies force development of new test strategies for x86 architecture
Fachhochschule St. Pölten
Silicon chip "replaces" rare earths
University of New South Wales
Plastics get electric
Schreiner ProSecure
Reliable authentication - new covert security feature for proof of authenticity
Rittal
New enclosure heaters - no chance of condensation
adaptronic Prüftechnik
Work safety and economy at the high voltage test of electrical distribution systems
STATS ChipPAC
Enhanced flip chip packaging delivers low cost solution with superior reliability for advanced silicon nodes
Manncorp
Split-version rework station hat auto removal / placement head for BGAs and QFPs
Physik Instrumente
Six-axis motion in cacuums up to 10-6 hPa
Physik-Instrumente
Fast piezo focusing systems: digital and more affordable
EPLAN Software & Service
Mechatronic workflow simplifies and speeds up the entire engineering process
Rittal
Climate control software with recooling configurator
Master Bond
Silver conductive epoxy meets NASA low outgassing standards
Essemtec
Tower automatic storage system increases the flexibility of production
Fraunhofer IMS
UV-transparent coating for image sensors
JNJ Industries
ESD roll creates instant ‘Blanket of Static Protection’ where needed
Fraunhofer-Institut für Sichere Informationstechnologie
Fingerprint makes chips counterfeit-proof
Chomerics Europe
Conductive coatings for shielding plastic medical equipment enclosures
Jenoptik
Advanced level of microoptics system integration for semiconductor and FPD-equipment manufacturers
Linn High Therm
New tube furnace with eight individual heating zones
ASM Assembly Systems
New placement standards for unusual board sizes up to 910 mm
Fischer Elektronik
Tube cases with integral guide slots for the accommodation of non-standard PCBs
Toshiba Electronics Europe
Access to mature technologies and long-life process support for European ASIC customers
Keithley Instruments
Parametric test systems for the semiconductor industry with enhanced throughput and accuracy
Rittal
Power distribution system - rapid solutions for switchgear manufacturing
Manncorp
New LED-capable pick-and-place systems
Fraunhofer-Institut für Silicatforschung
Nanoworld in color
Master Bond
High temperature resistant, toughened structural adhesive cures at room temperature
JTAG Technologies
Eleven performance-boosting enhancements to boundary-scan tool
Würth Elektronik
Unique adhesion soldering process enables flip chip bonding on the most varied of substrates
Rittal
With just a few clicks to the right subrack
Northwestern University
Breakthrough in converting heat waste to electricity
Aviv University
Debunking solar energy efficiency measurements
Binder
So cool, so safe - the safest ULT freezer (ultra low temperature) for the multi-user laboratory
Rensselaer Polytechnic Institute
New Generation of Nano-Batteries
Altair
Altair appoints general manager for europe
Fraunhofer-Institut für Photonische Mikrosysteme IPMS
A shorter trip to microscanners with a construction kit
Essemtec
Gaining Flexibility in SMT Production
SIPLACE
Firm focus on LED placement market
SCHMIDT Technology
Checking and managing air flows in the clean room
Universitäten Twente, Utrecht und Nankai
Chip with its own solare cell
National Institute for Materials Science
World’s first diamond nanoelectromechanical switch
Kollmorgen
New vehicle controller delivers big performance in tight spaces and tough conditions
Manncorp
Auto placer for prototyping/low volume assembly
Molex
External thread DIN valve connectors with IP67 sealing performance and superior cable retention
Master Bond
Thermally conductive epoxy delivers high temperature resistance & outstanding electrical insulation
Schreiner ProTech
Reliable marking of leak-proof lines for automotive air conditioning systems
GPD Global
Positive cavity displacement dispensing improves throughput and lowers cycle times
GÖPEL electronic
New boundary scan relays card for integration into ICT adapter systems
GMC-I PROSyS
AC/DC current probes offer simple clamp operation and measurement down to 1mA
GPD Global
Positive Cavity Displacement technology is proven compatible with silver-filled electrical and thermal epoxies
Essemtec
New drive system speeds printing
Vötsch Industrietechnik
As fast as lightning - technical optimization with temperature shock tests
Weiss Umwelttechnik
Most severe test for the solar technology - climate and temperature test for solar and photovoltaic units
Manncorp
Dual-head pick-and-place features ball screw X-Y and 30 µm, 3 Sigma accuracy
Schroff
New VPX clamshells remove heat and protect PCBs in defence applications
Laser Zentrum Hannover e.V. (LZH)
Optimized production of solar absorbers
Schroff
Impressive design and high functionality - New cabinet platform with 19" aluminium frame
Viscom
With closed X-ray tube to maintenance-free X-ray inspection
Viscom
AXI-OnDemand – fast and reliable defect detection with fewer false alarms
LPKF - LaserMicronics
Spray coating method for laser direct structuring (LDS)
Semiconductor Industry Association (SIA)
Chairman of Analog Devices elected SIA Chairman
Physik Instrumente
Piezo-based linear drive for automation technology - self-locking and non-magnetic
Toshiba Electronics Europe
130nm BiCD for next-generation automotive-rugged integration
Chomerics Europe
EMI shielding gasket provides ideal solution for medical equipment enclosure applications
IBM
New Chip Technology dramatically increases the memory capacity and processing speeds
American Institute of Physics
"Chaogates" hold promise for the semiconductor industry
SIPLACE
Placement machines for sensor manufacturing specialist
Seika Machinery
Quick adjustment times for magazine racks
SÜSS MicroTec / Fraunhofer IST
New technology for selective surface treatment
Weiss Umwelttechnik
Robot operation in all climatic zones
Vötsch Industrietechnik
The key to success - temperature and climatic test chambers
DEK
Breakthrough new ‘fluxophobic’ stencil coating technology
Binder
Complete program - environmental simulation chambers from 53 – 720 l
Hofmann Leiterplatten
PCBs in AML Technology also work as cases
Fraunhofer-Institut für Lasertechnik (ILT)
Conductor paths for marvelous light
Reinhausen Plasma
Metallize and coat more easily, more cost-effectively and with less environmental impact
Schmidt Technology
Minimum expense for maximum saving - flow sensors specifically for compressed air applications
Coherent
New direct diode system for OLED FRIT welding, plastic welding and soldering
FCT Assembly
New no-clean leaded halogen-free solder paste
Xilinx
Stacked Silicon Interconnect extends FPGA technology to deliver “more than moore” density, bandwidth and power efficiency
Rittal
Air cooling in the machine room
Rensselaer Polytechnic Institute
Water could hold answer to graphene nanoelectronics
National Institute for Nanotechnology (NINT)
Microwave oven key to self-assembly process meeting semi-conductor industry need
DuPont
New films for flexible and thin film photovoltaic applications
Wittmann Battenfeld
Optimal parts quality through online thermography
Fraunhofer IST
Producing circuit boards with plasma
ACE Production Technologies
New selective soldering programming software
RFMD
GaAs technologies manufactured in europe
VDMA
Dr. Thomas Lindner elected President of the VDMA
EV Group
New rechnology achieves ultra-high-resolution patterning down to 12.5 nm
JTAG Technologies - electronica A1.221
Full-featured value boundary-scan developers suite offers complete JTAG development package
Original1 und Schreiner ProSecure
Tracking down fakes with intelligent systems
Schroff
High demands made of cabinets in railway systems - shock resistance up to 5g
Bliss Industries
SMT splicing cart demos now available
BPM Microsystems
Industry’s fastest universal device programmer
Acculogic
Double-sided, multi-probe flying probe system with 3-D probing, analog, digital and boundary scan test capability
Keithley
Semiconductor parametric test software provides new levels of usability, convenience and productivity
Essemtec
Flexible SMT pick-and-place machine simplifies complex tasks
Lütze
Solar cable and connector range for photovoltaic applications
Trumpf
New ceiling-mounted supply units enables individual configuration
Acculogic
Reverse engineering software
Schroff
One platform for countless possibilities - robust products for railway systems
Sensor Products
Sensor system ensures optimal heat sink efficiency
Northwestern University and the University of Illinois
New method to print electronics on complex surfaces
Becquerel Prize
Prof. Dr. Hans-Werner Schock received the prestigious "Becquerel Prize
Sensor Products
Solar conformal coating
Coherent
New turn key laser-based process tools for c-Si cell manufacturing
University of California, Berkeley
An artificial skin out of nanowires
Essemtec
Highly flexible and fast SMD assembly machine
Data I/O
Support for SOT-23 packages in automated handlers
OKW Odenwälder Kunststoffwerke
Wall-mounted and desktop series - modern dialog
Essemtec
Selective radiation soldering for flex-circuits
Fraunhofer IST
Playing snooker with atoms
Newport
Integrated overhead shelf for optical tables
Juki
New modular placement systems
Oerlikon Solar
Two world records - lowest module production cost and highest lab cell efficiency
Master Bond
Room temperature curing, flexibilized epoxy combines high strength and toughness with chemical and abrasion resistance
Keithley Instruments
New switch mainframes boost system throughput for semiconductor test applications
State-of-the-art manufacturing
Computrol’s capabilities provide customers with cost-efficient contract manufacturing
Mill-Max
New receptacles with organic fibre plug solder barrier
Manncorp
New line of rework systems
Jenoptik-Sparte Laser & Materialbearbeitung
New laser systems for crystalline photovoltaic
SUSS MicroTec
SUSS MicroTec appoints Dr Rainer Knippelmeyer as Vice President R&D
CyberOptics
Industry’s first ever modular AOI solution for populated printed circuit
Schroff
New 19in. chassis features all-aluminium design
DOE's Oak Ridge National Laboratory
Solving Graphene Mystery
Rittal
Low-voltage switchgear - every version from one construction kit
VJ Technologies
New rework platform at Electronica/Productronica India 2010
SIPLACE
Whispering-down-the-Line - more efficient forwarding of ink spot and barcode data raises the line output
HEI
Engineering system for rigid, flex, and rigid flex boards
Rittal
Hygienic Design series - terminal boxes now safer and cleaner
Tyco Electronics
New high accuracy double sided printer for marker sleeve printing
Rehm Thermal Systems
New series of solar equipment for metallization lines
LIMO
Higher yield with diode lasers for fast in-line solar cell inspection
Applied Materials
Advanced microchip designs with breakthrough flowable CVD technology
Harvard University
New nanoscale transistors allow sensitive probing inside cells
Master Bond
Thermally conductive, low viscosity epoxy features cryogenic serviceability
CyberOptics
World’s fastest AOI system and newest SPI system at Productronica India 2010
Rittal
Software helps in assembly
Vi TECHNOLOGY
Pin through hole inspection as a single test or part of a mixed mode SMT/THT process
Vitronics Soltec
Enhanced reflow system offering improved performance in terms of ease of use
Count On Tools
Complete line of Panasonic CM nozzles
Fraunhofer-Institut für Lasertechnik ILT
Glass biochips for medical engineering - resource-friendly, cost-effective and high-quality
Gen3 Systems
New and improved cleanliness testers
Corelis
Low voltage JTAG adapter for Intel processors
SIPLACE
Stable production processes thanks to fewer production interruptions and faster restarts of the line
Atlantic Zeiser
Advanced printing innovations for the coding of packaging and labels
Linn High Therm GmbH
Microwave chamber furnace for research and design
Keithley
Free CD of nanotechnology test tutorials
Bergquist
Superior dielectric lowers operating temperatures
Gutenberg Research Award 2010
Professor Shoucheng Zhang of Stanford University receives the 2010 Gutenberg Research Award
Purdue University
New system to cool "power electronics"
University of Southern California
New breed of solar cells of transparent atom films
Max-Planck-Instituts Polymerforschung
Nanoribbons for graphene transistors
Siemens Electronics Assembly Systems
Waffle pack changer with non-stop module
Christopher Associates
New solder paste printing process guide
Master Bond
New chemically resistant electrically insulative structural adhesive with exceptional strength properties
SEHO Systems
Innovative fluxer spray head to reduce flux consumption
X-FAB
Industry’s first 100V high-voltage 0.35 micrometer foundry process
Electronic Interconnect
DFM service catches PCB design problems up front
Essemtec
Pick-and-place system dispenses solder paste of 100 µm diameters
Physik Instrumente (PI)
Industrial robot turns into precise machining system
Weber Ultrasonics
New 250 kHz ultrasonic generator allows careful and efficient cleaning of the most sensitive substrates
Touchdown Technologies - Verigy
Industry’s lowest force probe card protects devices-under-test from potentially damaging stresses
Siemens
System for point-of-use ultrapure water treatment systems for semiconductor applications
Rohde & Schwarz
Change at the helm of Rohde & Schwarz: Manfred Fleischmann succeeds Michael Vohrer
EV Group
New wafer bonder system for university and R&D customers at an affordable cost
Rittal
For the first time - modular refrigeration machines
Institute of Materials Research and Engineering (IMRE), University of Cambridge (UK), Sungkyunkwan University (South Korea)
The thinnest metal lines in the world speed up miniaturisation of electronic devices
Odenwälder Kunststoffwerke Gehäusesysteme
Biodegradable plastics - the future for plastic cases
Fraunhofer-Institut für Fabrikbetrieb und -automatisierung
Robots get an artificial skin
GÖPEL electronic
New optical inspection system for automated donformal coat inspection
Vi TECHNOLOGY
New AOI series - a breakthrough inspection solution for the camera modules manufacturing industry
Count On Tools
Custom SMT nozzles for CREE LEDs
French National Center for Scientific Research
Barrier to faster integrated circuits may be mere speed bump
Rensselaer Polytechnic Institute
Ultra-simple method for creating nanoscale gold coatings
PHODYE
First nanoelectronic "mini-circuits"
austriamicrosystems
New version of process design kit for 0.18µm high-voltage CMOS technology
Inovar
Shop floor tracking
Schroff
Cabinet passed MIL-STD-901D shock-resistance test
GES Electronic & Service
Combination-module with pneumatic valve and electrical contacts
Erstmals Die Bonding und SMT-Bestückung in einem Bestückprozess
Die Bonding and SMT placement in one placement process
Multitest
MEMS solution for pressure sensors
Aqueous Technologies
New automatic defluxing and cleanliness testing system
Rittal
Heating and cooling in one - Peltier cooling units with new functions
Martin / Finetech
Standalone BGA reball and QFN solder bumping unit
Thermophotovoltaic
Imec significantly reduces cost of germanium-based thermophotovoltaic cells
Samsung Semiconductor Europe
Industry's first 32nm low power High-K Metal gate logic process
Master Bond
One part high strength epoxy with high thermal conductivity meets NASA low outgassing specifications
SIPLACE
New setup concept - virtual component tables enable product changeovers with no downtime
Essemtec
3-D digitize first - measure later
CyberOptics
New SMT inspection solutions
Siemens Electronics Assembly Systems
New placement machines and lots of software for build-to-order
Herbert Reichl to Receive 2010 IEEE Components, Packaging and Manufacturing Technology Award
U.S. Department of Energy's Brookhaven
The secret dance of electrons
Kundenspezifische Lösungen
Essemtec’s Essemsol to focus on application development
Binder
High-precision, rapid-response preheating chamber
Limata GmbH
Innovative technology for the production of conductor boards
Fraunhofer-Institut für Angewandte Polymerforschung
Brilliant counterfeit protection
University of Illinois
Gallium arsenide for solar cells
Seika Machinery
Pocket handy BGA solder ball checker
Manncorp
New two higher-throughput PCB assembly systems
Baolab
Nnanoscale MEMS inside the CMOS wafer
Advanced Interconnections Corp.
New BGA socket for 0.50mm pitch BGA device test & validation
BPM Microsystems
Support for Exar’s power family of programmable power solutions
Molex
Junction box and cable assemblies for PV-panels
SIPLACE
Getting a handle on warehouse and inventory management
Essemtec
Tower maximises profit
Bergquists
New thermal dielectric provides superior heat transfer for high power lighting LED applications
Chomerics
Ni/Al filled elastomer gaskets that combine high shielding effectiveness and excellent galvanic compatibility
GÖPEL electronic
In-System Emulation Technology extended to non JTAG Debug Interfaces for the first Time
Rittal
Electromobility - new enclosure technology for power charging stations
University of Illinois
Redefining electrical current law with the transistor laser
VJ Technologies
IR Pre-heaters with advanced control
Master Bond
Single component snap cure epoxy has outstanding electrical properties and chemical resistance
Orthodyne Electronics
New series wire bonders for smaller, thinner and denser discrete power semiconductor packages
Fraunhofer-Institut für Werkstoffmechanik
Perfectly non-reflecting
Berkeley Lab
Supercapacitors through common microfabrication techniques
Schroff
AdvancedTCA system - on the information superhighway at 40 Gbit/s
University of Manchester
Mobile phone processors simulate human brain
Hermes-Award
The Hermes Award 2010 goes to LPKF
ASYS Group - DynTest Technologies
New product line for cost-efficient singulation of high-brightness LEDs
Manncorp
New lead-free compact wave solder machine has features of larger systems
Trumpf
Lasers for today's solar cells and those of the future
FCI
New flexible circuit assemblies to increase design flexibility
Mydata
Next generation of pick and place machines
Schroff
New dehumidifier system removes harmful condensation from inside an enclosure
SIPLACE
New import function for irregular BGAs
Essemtec
Automatic SMD storage system right next to the pick-and-place system saves time
Rittal
Intelligent power grid of the future
LPKF Laser & Electronics
Innovation potential honored
Fraunhofer-Institut für Elektronenstrahl- und Plasmatechnik FEP
Smoothing the way for economic flexible OLEDs
Essemtec
Pick-and-place system equipped with advanced drive system
Landshut Silicon Foundry - ChipStart
Foundry services enhances broad supply chain offerings
Odenwälder Kunststoffwerke Gehäusesysteme
Sterile plastic surfaces - permanent protection against bacteria, viruses and fungi
ROFIN and VisionTools
New innovative DataMatrix code for laser marking applications
SEHO Systems
Teaching is simpler than ever with new offline teaching program for selective soldering systems
Schroff
Printed circuit board accessories for applications exposed to high shock and vibration
Physik Instrumente (PI)
Positioning systems - fit for use in high vacuum
Hewlett-Packard
“Memristor” set to replace transistors
Vi TECHNOLOGY
New fast and compact AOI solution
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Up-to-date - 09.02.2012
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