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Up-to-date - 07.02.2012
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SÜSS MicroTec
New platform for permanent wafer bonding, debonding and cleaning
SUSS MicroTec launched the XBC300 Gen2, a high volume manufacturing platform for advanced 3D processing. The new bonding equipment can be used for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers. It is designed for production as well as process development.
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Up-to-date - 07.02.2012
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